Packaging Architect Design Engineer
Listed on 2026-07-19
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Engineering
CAD/ AutoCAD/ Mechanical Design, Systems Engineer, Electronics Engineer, Hardware Engineer
Job Description
Hiring a talent in advanced packaging design with intensive hands‑on experience in GDSII‑based physical layout and in‑depth knowledge in advanced 2.5D/3D packaging architect and technology. Skills in .mcm‑based layout is a plus.
Job ScopeBachelor's degree in Engineering and 5+ years of related experience or Masters degree in Engineering and 3+ years of related experience
Compensation and BenefitsThe annual base salary range for this position is $91,000 - $146,000. This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package:
Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
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