Electronics Engineer III

Electronics Engineer III – PCB Layout Design

We are seeking an experienced Electronics Engineer III to join a highly collaborative engineering team focused on developing advanced high-performance storage and computing solutions. This is an exciting opportunity to work on complex, high-speed PCB designs while partnering with global engineering teams to bring innovative products from concept to production.

In this role, you will play a key part in the design and development of sophisticated rigid and rigid-flex printed circuit boards, contributing to products that demand exceptional performance, reliability, and precision.

• Design and develop complex multilayer rigid and rigid-flex PCB layouts for advanced electronic systems.
• Take PCB designs from schematic netlist through final manufacturing release, including ODB++ and Gerber generation.
• Collaborate closely with Mechanical, Signal Integrity (SI), Power Integrity (PI), Thermal, Manufacturing, and Product Engineering teams.
• Route and optimize high-speed interfaces including DDR memory, PCIe, NAND flash, and other critical signal paths.
• Work directly with fabrication and assembly vendors to resolve DFM issues and support successful product launches.
• Participate in design reviews and contribute to best practices for PCB design methodologies, materials, processes, and tools.
• Solve challenging packaging, routing, and layout constraints while balancing performance, manufacturability, and reliability.
• Partner with engineering teams located across North America, Asia, and the Middle East to support globally developed products.

• Bachelor's Degree in Electrical Engineering, Electronics Engineering, or a related technical discipline.
• Minimum of 5 years of professional PCB layout experience.
• Strong proficiency with Cadence Allegro PCB Designer.
• Demonstrated experience designing complex, high-density, multilayer PCB layouts.
• Experience with high-speed digital designs involving: DDR memory interfaces, PCIe architectures, NAND Flash memory.
• Hands-on experience with advanced PCB technologies including: blind and buried vias, microvias, through-hole technologies, rigid-flex PCB designs.
• Strong understanding of PCB manufacturing processes, design for manufacturability (DFM), and vendor collaboration.
• Ability to work independently while contributing effectively within a highly collaborative team environment.

• Experience with System Capture and EDM library management.
• Background supporting enterprise hardware, storage, networking, computing, or high-performance electronic products.
• Familiarity with advanced packaging technologies and signal integrity considerations.

• Work on innovative, next-generation hardware products.
• Collaborate with world-class engineering talent across multiple disciplines.
• Tackle complex technical challenges involving high-speed design and advanced PCB technologies.
• Gain exposure to global product development and manufacturing environments.
• Opportunity for contract extension and potential long-term career growth.