Design Engineer III – RF Design Engineer

Schedule: First Shift

Salary Range: $100,000–$115,000

We are seeking an experienced RF Design Engineer to lead the design, development, and validation of high-frequency electronic circuits and systems supporting mission-critical aerospace, defense, industrial, and medical applications. This role requires expertise in RF and microwave circuit design, high-frequency PCB technologies, and system integration, along with the ability to collaborate across engineering disciplines and interact with customers on technical solutions.

• Design and develop RF and microwave circuits including amplifiers, filters, mixers, oscillators, antennas, and related components.
• Create schematics, perform simulations, and support PCB layout for high-frequency circuit designs.
• Select and implement appropriate RF PCB materials, including Rogers laminates (RO4350B, RO4003C, RT/duroid series) and other high-performance substrates.
• Perform RF simulations using industry-standard tools such as:
  • Keysight ADS
  • Ansys HFSS
  • Cadence AWR Microwave Office
• Optimize impedance matching, signal integrity, EMI/EMC performance, and overall RF system performance.
• Develop RF validation plans and conduct laboratory testing using vector network analyzers (VNA), spectrum analyzers, signal generators, power meters, and related test equipment.
• Partner with PCB layout, mechanical, manufacturing, and test engineering teams to ensure designs meet performance, manufacturability, and reliability requirements.
• Support Design for Manufacturability (DFM), Design for Assembly (DFA), and new product introduction activities.
• Participate in customer technical discussions, design reviews, and requirements definition.
• Support prototype builds, troubleshooting, root cause analysis, and production ramp activities.

• Bachelor's or Master's degree in Electrical Engineering or a related engineering discipline.
• 8+ years of experience designing RF and microwave circuits.
• Strong understanding of:
  • Transmission line theory
  • Impedance matching
  • S-parameters
  • Electromagnetic (EM) theory
• Experience designing multilayer RF PCBs with controlled impedance structures.
• Hands‑on experience using RF laboratory equipment, including VNAs, spectrum analyzers, signal generators, and power meters.
• Working knowledge of high-frequency PCB materials and stack‑up design.

• Experience designing mmWave or high-frequency systems above 10 GHz.
• Familiarity with hermetic packaging and high-reliability electronic assemblies.
• Experience with LTCC, hybrid circuits, or RF module‑level design.
• Knowledge of military, aerospace, or other high-reliability design standards, including MIL‑STD and IPC Class 3.
• Experience designing products for harsh operating environments involving temperature extremes, vibration, or radiation exposure.

• RF circuit design, modeling, and simulation
• Signal Integrity (SI) and Power Integrity (PI) analysis
• RF PCB design and layout guidance
• Hardware debugging and root cause analysis
• Cross‑functional engineering collaboration
• Customer‑facing technical communication and design presentations
• Design for Manufacturability (DFM) and Design for Assembly (DFA)

Due to ITAR and/or Controlled Unclassified Information (CUI) requirements, applicants must be U.S. Citizens
.