Lead Scientist - Advanced Packaging & Chiplet Integration
Listed on 2026-09-30
-
IT/Tech
A
* STAR Research seeks a Scientist or Senior Scientist to advance 2.5D interposer and 3D stacking assembly processes for heterogeneous integration. You will drive micro-bump bonding and chip-to-wafer technologies, collaborating with design and wafer teams to set design rules and roadmaps.
The role requires a PhD and 5–10 years in semiconductor packaging, with demonstrated leadership in complex project execution and external partnerships across North America, Europe, and Asia.
The Lead Scientist - Advanced Packaging & Chiplet Integration role at A
* STAR Research is now open for applications in HI, United States.
For the Lead Scientist - Advanced Packaging & Chiplet Integration position at A
* STAR Research, we are reviewing applications now.
Step into the Lead Scientist - Advanced Packaging & Chiplet Integration role at A
* STAR Research in HI, United States and grow with us.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).