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Mid-Sr Avionics Mechanical Engineer

Job in Kent, King County, Washington, 98089, USA
Listing for: Front Door Defense
Full Time position
Listed on 2026-07-24
Job specializations:
  • Engineering
    Aerospace / Aviation / Avionics, Mechanical Engineer, Systems Engineer, Electronics Engineer
Salary/Wage Range or Industry Benchmark: 109725 - 327810 USD Yearly USD 109725.00 327810.00 YEAR
Job Description & How to Apply Below

Mid-Sr Avionics Mechanical Engineer Lead development of flight avionics packaging and integration for Stoke Space's Nova vehicle

Location:

Kent, Washington

Compensation: $109, USD / year

About

The Role

At Stoke, we believe a thriving space economy will enable a vibrant, sustainable, and equitable future here on Earth. That is why we're building Nova, our fully and rapidly reusable launch vehicle. Designed for daily flight, Nova tackles the core challenges of space transportation by reducing cost, increasing availability, and improving reliability. By radically lowering launch costs and increasing flight cadence, we're helping create a truly scalable space industry.

Our team is mission-driven, collaborative, and empowered to take ownership of their work. If you want to work alongside some of the most dedicated and talented people on Earth, we'd love to have you join us.

Job Description

The avionics system is the backbone of highly reusable, operable, and reliable space systems. As an Avionics Mechanical Engineer at an early‑stage start‑up you will be responsible for developing mechanical solutions for component packaging and launch vehicle integration of flight avionics hardware. You will work closely with the avionics development, structures, and production teams to design and implement those solutions, and continuously iterate to improve your designs.

You will seek out state‑of‑the‑art solutions to difficult problems and you will assist in the definition of company standards for avionics development. You must be ready to stay focused, move fast, self‑direct, and learn on the fly.

Responsibilities
  • Design, manufacture, and test packaging for flight avionics, electronics, and electro‑mechanical actuators
  • Design, manufacture, analyze, and integrate launch vehicle harness routing and secondary structure, ensure these systems are structurally capable of surviving vehicle load cases. Create CAD models and drawings
  • Perform thermal, structural, and tolerance analysis for electro‑mechanical assemblies using both hand calculations and FEA
  • Failure analysis of components as it relates to thermal, loads, vibration and shock
  • Interface with machine shops and production teams to integrate design for manufacturing best practices and produce hardware needed for qualification and flight
  • Own the hardware delivery timeline and success through inception, design, assembly, test, and integration
  • Lead design reviews both internally and externally
  • Drive continuous improvement efforts to increase throughput and reduce cost to meet the launch target
Minimum Qualifications
  • Bachelor of Science (B.S.) in Mechanical Engineering, Aerospace Engineering, or a related technical field (or equivalent practical experience)
  • 3+ years of professional experience in mechanical or electromechanical design and analysis (relevant internship and significant student‑project experience may count toward this requirement)
  • Proficiency with parametric 3D CAD and 2D drawing creation
  • Demonstrated experience taking hardware from concept through design, analysis, manufacturing, and test
  • Working knowledge of structural and thermal analysis fundamentals using hand calculations and/or FEA
  • Solid understanding and application of GD&T per ASME Y14.5
  • Strong understanding of machining, sheet metal fabrication, and additive manufacturing
Preferred Qualifications
  • Hands‑on experience with NX (or comparable CAD) and Ansys (or comparable FEA)
  • Structural, modal, and tolerance‑stack analysis of electromechanical assemblies
  • Ability to perform thermal analysis for avionics and electronics components
  • Designing electronics and component packaging for extreme environments (thermal, vibration, shock, vacuum)
  • Harness routing and secondary structure design
  • Collaboration with PCB designers; exposure to PCB layout and packaging constraints
  • Exposure to low‑volume / high‑mix production design
  • Experience with vibration, shock, thermal, and fatigue testing of electromechanical assemblies
  • Familiarity with developing and executing qualification and acceptance test campaigns
  • Self‑motivated and highly organized, with excellent written and verbal communication and rigorous attention to detail
Benefits
  • Equity –…
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