Packaging Design Architect: Substrate & SiP Expert
Listed on 2026-10-06
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Design & Architecture
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Engineering
Intel Corporation in the United States is seeking a Packaging Design Architect to drive end-to-end substrate design from concept through tape-out. You will define design rules, perform routing studies, and collaborate with silicon and hardware teams to optimize silicon-package-board performance and pinout.
With a strong background in semiconductor packaging and 10+ years in package/PCB design, you will resolve DRCs, conduct reviews, and document collateral in the PLM system.
This posting is for the Packaging Design Architect:
Substrate & SiP Expert role at Intel Corporation, based in Northern, KY, United States.
Are you ready to take on the Packaging Design Architect:
Substrate & SiP Expert role at Intel Corporation?
We would love to welcome a new Packaging Design Architect:
Substrate & SiP Expert to our group in Northern, KY, United States.
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