Process Development Engineering Intern

Posted Monday, February 2, 2026 at 6:00 AM

Bold Thinking. World Changing. At Sky Water, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life‑saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location — employees join together to improve the world.

Explore what’s possible. Joining our U.S.‑based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning “science fiction” into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro‑mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few.

Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services.

Step into the future. Sky Water’s values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees — and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.

Are you bold thinking? Find your place on our team and help us change the world!

Our Internship program offers students an opportunity to receive training in a hi‑tech environment. Throughout your internship, you will gain on‑the‑job process development experience while working alongside experienced professionals who provide you with both guidance and autonomy as you work on challenging projects. Our internship programs run typically May - August each year.

Support the efforts of Process Development Module Engineers to prepare for and execute new semiconductor packaging processes.

The following project descriptions are meant to capture the flavor of the projects that the interns will work on. Individual project assignments may vary from the descriptions provided below, depending on the immediate business needs.

Project

Summary:

The Dicing Intern will work with the process engineers to characterize process sensitivity of Kerf width as a function of process parameters such as saw blade thickness, Grit size, bond hardness, spindle rpm, feed rate and coolant pressure/ flow parameters.

Key Objectives:

• Run experiments and generate Kerf maps of common substrates and thicknesses.
• Interpret CAD drawings from the customer and develop a methodology to set up dicing automation accordingly.
• Controlled test cuts will be performed on common substrate materials and thicknesses.
• Kerf will be measured precisely using standard methods and Kerf maps will be generated.
• The intern will also assist the dicing engineer in interpreting CAD files and setting up the Dicing tool automation accordingly.

Project

Summary:

The Backgrind process intern will focus on understanding and controlling the variables that affect the grind process CTQs, namely final thickness, surface quality, grind stress, yield and throughput.

Key Objectives:

• Understand the impact of key process input variables, and achieve tight thickness uniformity, control warpage, and prevent subsurface damage and cracks.
• Optimize throughput and quality during the backgrind and top grind process.
• Develop familiarity with consumable toolsets and process metrology tools such as Keyence microscopes.
• Evaluate the effect of process input variables such as:
  • Device side topography, pre‑grind warpage, grinding abrasive grit, bond type, dressing condition, dressing tape type, feed rate, downforce, coolant flow rate, on final thickness, TTV, WIWNU, mechanical grinding stresses, chipping, delamination, microcracking, post‑grind warpage, and die cracking.