Advanced Packaging Microelectronics Integration Engineer - Fan

Position Summary

We are looking for a hardworking, passionate experienced Sr. Process Integration and Development Engineer for our Florida Advanced Packaging site. In this role, you will lead, develop, and improve an overall integrated Advanced Packaging process flow to deliver a qualified product to our foundry clients. Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.

• Gain/utilize knowledge of the capabilities and interdependencies of tool sets within the process flow to create recipes that utilize temporary and permanent bonding, electrolytic / PVD metal deposition, dielectric deposition, photolithography, etch, CMP, bake, reflows, flip chip, and wire bond tools.
• Process integration for a wide variety of clients that include MEMS, Photonics, High Performance Computing, CMOS, Memory, AI, and Quantum devices.
• Integrate TSV first and/or TSV last process flows to enable Foundry client packages.
• Utilize metrology tools to characterize process conditions, identify root causes of defects, and document results.
• Investigate and drive integration changes for improved device performance and yield.
• Work with process and tool engineers to find processing marginalities and make improvements.
• Routinely monitor selected in line and end-of-line SPC charts for trends or excursions that can be addressed by integration changes.
• Utilize data analysis software to drive data‑driven decisions.
• Create quick‑turn cycles of learning to identify issues early and create a final product and process flow for Foundry clients.
• Incorporate, monitor, and improve electrical test parameters to deliver an electrically good final package.
• Create end‑to‑end process flows to aid in project scoping.
• The job also requires performing other duties as assigned.

Education:

BS Engineering, MS/PhD preferred.

• 10+ years of Process Development & Integration Engineer experience in Advanced Packaging Fab environment of 10K and 1K clean rooms related to Fan Out wafer level assembly.
• Advanced Packaging Fab processing tools knowledge/experience.
• MEMS, Photonic, HPC, AI, ASIC, Quantum device and integration knowledge with relevant combination of years of experience and/or advanced degree.
• Knowledge of DOE, SPC, and 6‑sigma concepts and applications.
• Project Management skills and/or defined training a plus.
• Clear problem‑solving capability, data‑driven, inventive solution oriented and can articulate thought processes.
• Can work both independently and in cross‑functional teams for problem solving.

US Citizenship

Required:

This position will require the holding of, or ability to obtain, a US government security clearance.

The annual salary range for this role is $158,960 – $238,440. Pay offered is based on many factors including, but not limited to, the job‑related experience, skills, education, and credentials of each candidate.

Sky Water offers an exciting environment where the brightest semiconductor minds come together to achieve exceptional results. We offer competitive salary and an opportunity to participate in incentive plans as well as other employee financial benefits including 401k match, life insurance, and opportunities to purchase Sky Water stock at a discounted rate.

Additionally, Sky Water offers a comprehensive benefits package which promotes a healthy life. This includes benefit eligibility day one, medical, dental, mental health benefits, vision, legal planning, short‑ and long‑term disability, paid time off, paid holidays, an on‑site fitness facility, and an on‑site self‑serve market.

Sky Water complies with federal and state disability laws and makes reasonable accommodations for applicants and employees with disabilities unless doing so would cause an undue hardship. Alternative methods of applying for employment are available to individuals unable to submit an application through this site because of a disability. To request reasonable accommodations, to participate in the job application or interview process, to perform essential job functions, and/or to receive other benefits and privileges of employment, please contact Human Resources at  or Recr

EOE, including disability/vets