Advanced Packaging Section Manager, Process Development Engineering

Position Summary:

We are seeking a hands-on engineering leader to drive process development and team performance within our Advanced Packaging organization. This role leads a team of Process Development Engineers and is responsible for delivering stable, scalable, and high-performing processes across multiple packaging technologies. You' will operate at the intersection of engineering, manufacturing, and equipment balancing technical depth with leadership to improve yield, throughput, and capability.
Major Area of Accountability:

Lead and develop a team of Process Development Engineers supporting advanced packaging technologies, including Fan-Out Wafer Level Packaging, Interposers, Hybrid Wafer-to-Wafer Bonding, and Die-to-Wafer Bonding.
Preferred experience in one or more of the following areas:
Wafer Singulation, Solder Bumping, Die Attach, Compression Molding, Hybrid Bonding, Temporary Bond/Debond, Lamination, Maskless Lithography, Thin Films (PVD/CVD), Dry / Wet Etch, Diffusion, Electroplating (ECD), CMP, Metrology and Probe/Test.
Drive process performance through data owned SPC strategy, implementation, and continuous improvement.
Responsible for the ongoing Process Development activities of the team in support of all Advanced Packaging Technologies.
Lead, develop, and manage a team of Process Development Engineers across multiple Advanced Packaging disciplines.
Hands-on engineering leader to drive process development and team performance within our Advanced Packaging organization.
This role leads a team of Process Development Engineers and is responsible for delivering stable, scalable, and high-performing processes across multiple packaging technologies.
Operate at the intersection of engineering, manufacturing, and equipment balancing technical depth with leadership to improve yield, throughput, and capability.
Partner with equipment engineering and maintenance to resolve tool issues, eliminate chronic failures, and improve uptime.
Oversee process qualification and ramp of new tools to expand fab capability and capacity.
Lead root cause analysis and implement permanent corrective actions for yield and reliability issues.
Collaborate cross-functionally with production, integration, procurement, and vendors to meet business objectives.
Balance multiple priorities across development, production support, and continuous improvement initiatives.

Required Qualifications

BS in Engineering (Materials Science, Electrical, Chemical, Physics, or related).
5-7 years of semiconductor manufacturing experience, including advanced packaging.
Demonstrated leadership experience (formal or informal).
Strong understanding of process integration and upstream/downstream interactions.
Proven problem-solving capability using structured methodologies.

Experience with SPC, APC, and data-driven process control.
Proficiency with data analysis tools such as JMP or MATLAB.
Ability to manage multiple priorities and deliver results in a fast-paced environment.

US Citizenship

Required:

This position will require the holding of, or ability to obtain, a US government security clearance.