Electroplating Engineer

200 Neo City Wy, Kissimmee, FL 34744, USA

Posted Tuesday, June 2, 2026 at 5:00 AM

Bold Thinking. World Changing. At Sky Water, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location — employees join together to improve the world.

Explore what’s possible. Joining our U.S.

- based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning “science fiction” into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few.

Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services.

Step into the future. Sky Water’s values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees — and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.

Are you bold thinking? Find your place on our team and help us change the world!

We are looking for a hardworking and passionate Electroplating Process Development Engineer for our Florida Advanced Packaging site working with copper, nickel, SnAg and gold plating. In this role you will develop and improve processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP).

Excellent oral and written communication skills are required to effectively and efficiently communicate ideas with foundry customers, colleagues, and management.

• Own overall responsibility for plating process development area, drive improvements in process, documentation, training with new process development/transfer in a manufacturing environment.
• Develop or integrate robust manufacturable process recipes for Foundry customers in Copper, Nickel, Gold, or SnAg electroplating, wet etch chemistry and wet cleans.
• Lead or work in a team for process integration of advanced packaging solutions for platform Heterogenous Integration technologies and unique customer applications.
• Utilize metrology tools to characterize and document process results for transfer to production including CVS measurements, bath analysis and additions, thickness and fill characteristics.
• Investigate and drive integration changes for improved device performance and yield improvement.
• Work with process integration and tool engineers to find processing marginalities and make improvements.
• Routinely monitor selected in-line and end-of-line SPC charts for trends or excursions that can be addressed by process changes.
• Directly interface with management as a team leader or area owner for your unit process modules.
• Could develop into a Project Management position integrating Customer device requests.

The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.

Education:

BS Engineering (8 years), MS/PhD (5 years) preferred in Physics, Electrical Engineering, Materials Science or equivalent.

• Back-end-of-line (BEOL) or front-end-of-line (FEOL) fab processing tools knowledge/experience.
• 5-8 years of engineering experience.
• Develop or integrate robust manufacturable process recipes for Foundry customers in Copper, Nickel, Gold, or SnAg electroplating, wet etch chemistry and wet cleans.
• MEMS, Photonics,…