Process Engineering Manager - Films, Dry Etch, Wet Etch Plating

Position: Process Engineering Manager - Films, Dry Etch, Wet Etch, & Plating
Position Summary:

The Process Engineering Manager - Films, Dry Etch, Wets and Plate leads a team of process engineers and technical contributors responsible for wafer fabrication process development, sustaining, yield improvement, and technology transfer activities across assigned modules. This role provides senior technical and people leadership across thin films, dry etch, wet etch, cleans, plating, electrochemical processing, and related metrology in a cleanroom manufacturing environment.

Primary Scope:
Films, dry etch, wet etch, cleans, plating, electrochemical deposition, related metrology, module-level integration support, process control, sustaining, development, qualification, and transfer.

People Leadership Expectations:

Serve as the direct people leader for an engineering team, with accountability for team performance, engagement, development, and execution against business priorities.
Set clear goals, priorities, and expectations for individual contributors; ensure employees understand how their work supports fab, customer, program, and business objectives.
Provide regular coaching, feedback, recognition, and career development support for employees at varying levels of experience.
Build technical depth across the team by creating development plans, supporting knowledge sharing, strengthening process ownership, and delegating meaningful technical ownership.
Assess team capability, identify skill gaps, and partner with leadership, HR, and Talent Acquisition on workforce planning, hiring, onboarding, retention, and succession planning.
Create a culture of accountability, collaboration, safety, technical rigor, continuous improvement, and respectful communication.
Conduct performance management activities including goal setting, check-ins, development discussions, performance feedback, and corrective action when needed.
Develop future leaders by creating stretch assignments, mentoring high-potential employees, and building a bench of capable process owners.

Major Area of Accountability:

Lead process development, optimization, qualification, and sustaining activities for films, dry etch, wet etch, cleans, plating, and associated metrology processes.
Provide senior-level technical direction for thin film deposition, plasma etch, wet etch, cleans, electroplating / plating, process control, tool matching, and module-level integration interactions.
Drive process capability, yield improvement, defect reduction, film uniformity, etch selectivity, critical dimension control, contamination control, plating quality, and cost-of-ownership initiatives.
Lead root-cause investigations and corrective actions for process excursions, yield limiters, defectivity issues, tool matching gaps, contamination concerns, and reliability risks.
Apply DOE, SPC, process window analysis, statistical methods, and process capability analysis to improve process robustness and manufacturability.
Partner with integration, device, product, equipment, quality, operations, reliability, and program teams to resolve complex technical issues and meet customer commitments.
Guide new technology development, process transfer, process release, and qualification activities across CMOS, MEMS, photonics, photovoltaic, or heterogeneous integration platforms.
Establish and monitor key process metrics including yield, defects, tool matching, process capability, film thickness and uniformity, etch rate and uniformity, plating thickness, contamination control, documentation health, and excursion response.
Ensure compliance with safety, quality, documentation, change-control, customer, and cleanroom operating requirements.
Communicate status, risks, recovery plans, resource needs, and execution priorities clearly to senior leadership and cross-functional stakeholders.

Required Qualifications:

Education

B.S., M.S., or Ph.D. degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, or another relevant engineering discipline.

Experience and/or Training

Minimum of 15 years of experience in a wafer fabrication cleanroom environment.
Minimum of 2 years of leadership, supervisory, or management experience, preferably with direct people leadership responsibility.
Experience as a process or area owner for at least two relevant process areas such as thin films, dry etch, wet etch, cleans, plating, electrochemical deposition, or related module processes.
Experience working in CMOS, MEMS, photonics, photovoltaic, or heterogeneous integration / advanced packaging fabrication environments.
Demonstrated experience leading structured problem-solving efforts using 8D, 3D, Fishbone, 5 Why, fault-tree analysis, or similar methodologies.
Strong working knowledge of DOE, SPC, process capability analysis, and statistical methods, with the ability to teach and lead others in their application.
Demonstrated ability to lead cross-functional teams, manage multiple technical priorities, and deliver results in a fast-paced manufacturing or development…