Director of Advanced Packaging Process Engineering

Director of Advanced Packaging Process Engineering

200 Neo City Wy, Kissimmee, FL 34744, USA

Posted Friday, June 5, 2026 at 5:00 AM

Bold Thinking. World Changing. At Sky Water, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life‑saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location — employees join together to improve the world.

Explore what’s possible. Joining our U.S.

- based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning “science fiction” into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro‑mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few.

Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services.

Step into the future. Sky Water’s values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees — and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.

Are you bold thinking? Find your place on our team and help us change the world!

Position Summary:

Our Process Engineering Director is accountable to ensure the Process Engineering Team is continuously optimizing our manufacturing processes to be highly efficient with high yields and low cost. This role is also responsible for leading and developing Process Engineering leaders and teams to strengthen capability, accountability, and execution across the organization. In addition, they will closely collaborate with the Advanced Technology Services and Advanced Packaging Development Teams to create new manufacturing processes and capabilities, enabling the next generation of exciting new products to be manufactured at Sky Water.

Responsibilities:

• Define and refine a vision for the engineering team to create a purposefully driven, highly‑effecitve team
• Build effective teams to solve complex problems
• Lead, coach, and develop Process Engineering leaders to strengthen team capability, accountability, and execution
• Attract top talent and build pipeline of high potential engineers for future growth
• Ensure effective definition and deployment of Key Performance Indices (KPI’s) and Objectives and Key Results (OKR’s) to ensure operational and enterprise objectives are achieved
• Ensure collaboration within operations and other business functions to achieve enterprise objectives.
• Ensure deployment and effective use of structured problem‑solving methodologies to achieve effective Root Cause Corrective Action
• Stay current of emerging technology trends to ensure Sky Water is equipped with cutting edge capabilities in process control, factory automation, and process development
• Work with minimal supervision, balancing competing priorities, to serve the needs of the enterprise
• The job also requires performing other duties as assigned.

Required Qualifications:

Education: B.S. or M.S. Degree in Mechanical, Electrical or Chemical Engineering or Materials Science, Physics or other relevant engineering discipline. MBA preferred.

Experience and/or Training
:

• Minimum of 10 years experience of semiconductor technology development, advanced packaging and/or process integration experience
• Experience in Advanced Packaging preferred
• Proven track record of driving advanced packaging technology and/or semiconductor wafer fab technology from R&D to HVM (high‑volume manufacturing)
• Expert knowledge of semiconductor manufacturing processes (Litho, Etch, Deposition, CMP, etc) and/or advanced packaging technologies and formats (FOWLP, FCBGA, SiP, RDL, 3
  
  DIC, HBM).…