Process Engineering Manager - CMP, Dice, Grind & Bonding

Process Engineering Manager - CMP, Dice, Grind & Bonding

200 Neo City Wy, Kissimmee, FL 34744, USA

Posted Friday, June 5, 2026 at 5:00 AM

The Process Engineering Manager - CMP, Dice, Grind and Bonding leads a team of process engineers and technical contributors responsible for wafer fabrication process development, sustaining, yield improvement, and technology transfer activities across assigned modules. This role provides senior technical and people leadership across chemical mechanical planarization, wafer dicing, grinding/thinning, wafer bonding, debonding, surface preparation, cleans, and related metrology in a cleanroom manufacturing environment.

CMP, post-CMP cleans, wafer dicing, grinding, thinning, backgrind, wafer bonding, debonding, surface preparation, related metrology, process control, sustaining, development, qualification, and transfer.

• Serve as the direct people leader for an engineering team, with accountability for team performance, engagement, development, and execution against business priorities.
• Set clear goals, priorities, and expectations for individual contributors; ensure employees understand how their work supports fab, customer, program, and business objectives.
• Provide regular coaching, feedback, recognition, and career development support for employees at varying levels of experience.
• Build technical depth across the team by creating development plans, supporting knowledge sharing, strengthening process ownership, and delegating meaningful technical ownership.
• Assess team capability, identify skill gaps, and partner with leadership, HR, and Talent Acquisition on workforce planning, hiring, onboarding, retention, and succession planning.
• Create a culture of accountability, collaboration, safety, technical rigor, continuous improvement, and respectful communication.
• Conduct performance management activities including goal setting, check‑ins, development discussions, performance feedback, and corrective action when needed.
• Develop future leaders by creating stretch assignments, mentoring high‑potential employees, and building a bench of capable process owners.

• Lead process development, optimization, qualification, and sustaining activities for CMP, dice, grind, bonding, debonding, cleans, and associated metrology processes.
• Provide senior‑level technical direction for CMP, slurry/pad selection, endpoint strategies, post‑CMP cleans, wafer dicing, grind/thinning, wafer bonding, debonding, surface preparation, and related module‑level integration interactions.
• Drive process capability, yield improvement, defect reduction, surface quality, planarity, particle control, wafer strength, die quality, bonding integrity, void reduction, and cost‑of‑ownership initiatives.
• Lead root‑cause investigations and corrective actions for process excursions, yield limiters, defectivity issues, tool matching gaps, contamination concerns, wafer damage, bonding defects, and reliability risks.
• Apply structured problem‑solving methodologies such as 8D, 3D, Fishbone, 5 Why, fault‑tree analysis, and other formal root‑cause tools.
• Use DOE, SPC, process capability analysis, and statistical methods to improve process control, manufacturability, and long‑term stability.
• Partner with integration, device, product, equipment, quality, operations, reliability, and program teams to resolve complex technical issues and meet customer commitments.
• Guide new technology development, process transfer, process release, and qualification activities across CMOS, MEMS, photonics, photovoltaic, or heterogeneous integration/advanced packaging platforms.
• Establish and monitor key process metrics including yield, defect density, removal rate, non‑uniformity, dishing/erosion, surface roughness, die quality, wafer thickness, bonding strength, voiding, process capability, documentation health, and excursion response.
• Ensure compliance with safety, quality, documentation, change‑control, customer, and cleanroom operating requirements.
• Communicate status, risks, recovery plans, resource needs, and execution priorities clearly to senior…