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Equipment Engineering Manager

Job in Kissimmee, Osceola County, Florida, 34747, USA
Listing for: SkyWater Technology Foundry
Full Time position
Listed on 2026-06-27
Job specializations:
  • Engineering
    Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 136960 - 205440 USD Yearly USD 136960.00 205440.00 YEAR
Job Description & How to Apply Below

200 Neo City Wy, Kissimmee, FL 34744, USA

Job Description

Posted Tuesday, June 23, 2026 at 6:00 AM

Bold Thinking. World Changing. At Sky Water, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life‑saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location — employees join together to improve the world.

Explore what’s possible. Joining our U.S.

-based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning “science fiction” into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro‑mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few.

Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services.

Step into the future. Sky Water’s values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees — and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.

Are you bold thinking? Find your place on our team and help us change the world!

Sky Water is searching for an Equipment Engineering Manager for our Advanced Packing site at Kissimmee, FL. If you are a self‑motivated team player, who thrives in a fast‑paced, constantly changing environment, passionate about building great products and learning new technologies, this is the job for you!

In this role, you will have the opportunity to lead a skilled team of Equipment Engineers who endeavor to manage, maintain, and improve equipment operations with pride, while setting and reinforcing a culture of safety! The selected candidate will have extensive collaboration with the area Equipment Engineering Team, Equipment Maintenance, Facilities Maintenance, and Process Engineering groups. Some collaboration will be with tool vendors, other area engineers/managers, procurement, and production.

Responsibilities:

  • Manage Equipment Engineers in the FAB for all tool types and disciplines.
  • Participate in management of all new equipment installations and modifications, including initial documentation and PM creation.
  • Serve as a key player in planning to support continuous growth and efficient equipment operation.
  • Manage vendor contracts to achieve results, when needed.
  • Promote and maintain a safe work environment for all employees.
  • Ensure all processes and systems are compliant with regulations.
  • Manage, develop, and mentor equipment engineers.
  • Build and improve systems to ensure all manufacturing equipment is safe to operate and manufactures quality product.
  • Participate in resolving unplanned down events and driving permanent Root Cause Corrective Actions, using Lean processes, procedures, and problem‑solving tools.
  • Make daily resource allocation decisions, balancing competing priorities, to serve the needs of the Process, Equipment, and Manufacturing teams.
  • Drive cost reduction efforts to help achieve cost management and savings goals.
  • Provide technical leadership and management of 200MM and 300MM semiconductor processing equipment in support of Advanced Packaging processes including Fan Out Wafer Level Packaging, Interposers, Hybrid Wafer to Wafer bonding, and Die to Wafer Bonding. Highly desirable for a candidate to have a background in at least one of the following areas:
    Wafer Dicing/Grinding/Singulation, Photolithography, PVD and/or CVD thin films, dry etch, wet etch / wafer clean, diffusion, bond, electroplate (ECD), CMP, or metrology, probe/test (some areas may be combined).
  • Work with process engineering and equipment maintenance teams to drive root cause corrective actions of…
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