Process Engineering Manager - Films, Dry Etch, Wet Etch Plating

Bold Thinking. World Changing.

At Sky Water, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location — employees join together to improve the world. Explore what's possible. Joining our U.S.

- based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning "science fiction" into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few.

Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services. Step into the future. Sky Water's values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees — and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.

Are you bold thinking? Find your place on our team and help us change the world!

The Process Engineering Manager - Films, Dry Etch, Wets and Plate leads a team of process engineers and technical contributors responsible for wafer fabrication process development, sustaining, yield improvement, and technology transfer activities across assigned modules. This role provides senior technical and people leadership across thin films, dry etch, wet etch, cleans, plating, electrochemical processing, and related metrology in a cleanroom manufacturing environment.

Films, dry etch, wet etch, cleans, plating, electrochemical deposition, related metrology, module-level integration support, process control, sustaining, development, qualification, and transfer.

• Serve as the direct people leader for an engineering team, with accountability for team performance, engagement, development, and execution against business priorities.
• Set clear goals, priorities, and expectations for individual contributors; ensure employees understand how their work supports fab, customer, program, and business objectives.
• Provide regular coaching, feedback, recognition, and career development support for employees at varying levels of experience.
• Build technical depth across the team by creating development plans, supporting knowledge sharing, strengthening process ownership, and delegating meaningful technical ownership.
• Assess team capability, identify skill gaps, and partner with leadership, HR, and Talent Acquisition on workforce planning, hiring, onboarding, retention, and succession planning.
• Create a culture of accountability, collaboration, safety, technical rigor, continuous improvement, and respectful communication.
• Conduct performance management activities including goal setting, check-ins, development discussions, performance feedback, and corrective action when needed.
• Develop future leaders by creating stretch assignments, mentoring high-potential employees, and building a bench of capable process owners.

• Lead process development, optimization, qualification, and sustaining activities for films, dry etch, wet etch, cleans, plating, and associated metrology processes.
• Provide senior-level technical direction for thin film deposition, plasma etch, wet etch, cleans, electroplating / plating, process control, tool matching, and module-level integration interactions.
• Drive process capability, yield improvement, defect reduction, film uniformity, etch selectivity, critical dimension control, contamination control, plating quality, and cost-of-ownership initiatives.
• Lead root-cause investigations and corrective actions for process excursions, yield limiters, defectivity issues, tool matching gaps, contamination concerns, and reliability risks.
• Apply DOE, SPC, process window analysis, statistical methods, and process capability analysis to improve process robustness and manufacturability.
• Partner with integration, device, product, equipment, quality, operations, reliability, and program teams to resolve complex technical issues and meet customer commitments.
• Guide new technology development, process transfer, process release, and qualification activities across CMOS, MEMS, photonics, photovoltaic, or heterogeneous integration platforms.
• Establish and monitor key process metrics including yield, defects, tool matching, process capability, film thickness and uniformity, etch rate and uniformity, plating thickness,…