Member of Technical Staff; MTS of Advanced Packaging & Module Engineering

Position Summary

The Member of Technical Staff (MTS) of Advanced Packaging & Module Engineering is a strategic leader responsible for defining and executing the vision, scope, and long-term strategy for module engineering and advanced packaging across process and equipment. This role drives the development and industrialization of next-generation semiconductor packaging solutions from R&D through high-volume manufacturing (HVM), integrating technology innovation with operational excellence to deliver differentiated business outcomes.

The MTS is accountable for end-to-end module performance, including process development, qualification, statistical process control (SPC), and capability optimization. This leader partners cross-functionally across engineering, operations, and external stakeholders to deliver scalable, reliable, and cost-effective solutions. This role reports directly to the SVP of Engineering and operates as a peer to other senior engineering leaders, with enterprise accountability for advanced packaging and module engineering strategy and execution.

• Technological
  
  Roadmap:
  
  Define and drive the advanced packaging technology roadmap in partnership with the CTO, aligning with business objectives and market trends. Translate strategy into execution through integrated process and equipment development, ensuring clear linkage to measurable business outcomes.
• Continuous Improvement & Accountability:
  Drive a culture of data-driven decision-making and continuous improvement through operational metrics, process discipline, and structured performance reviews.
• Process Development & Module Performance:
  Lead the development, optimization, qualification, and documentation of advanced packaging technologies (e.g., 2.5D/3D integration, hybrid bonding, wafer-level packaging). Own end-to-end module performance, including yield, cost, cycle time, and reliability.
• Cross-Functional Leadership & Execution:
  Lead as a cross-functional liaison for teams across operations, Advanced Technology Services, Platform Technology, quality, supply chain, and IT/automation to enable seamless technology transfer, resolve complex technical challenges, and accelerate time to market.
• Yield & Quality Improvement:
  Drive improvements in process capability (Cpk), yield, quality, cost, and cycle time through statistical process control (SPC), advanced analytics, and data-driven problem-solving methodologies.
• External Partner & Customer Engagement:
  Serve as the primary technical interface for customers, research partners, and equipment/material suppliers to align technology roadmaps, support technology qualifications, and drive execution against business and operational objectives.
• Project & Program Management:
  Lead the execution of complex development and qualification programs from concept through HVM, ensuring alignment to technical and business objectives.

• Education:
  
  BS, M.S. or Ph.D. in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
• 12+ years of semiconductor technology development, advanced packaging, and/or process integration experience.
• Experience in Advanced Packaging preferred.
• Proven track record of driving advanced packaging technology and/or semiconductor wafer fab technology from R&D to HVM.
• Expert knowledge of semiconductor manufacturing processes (Litho, Etch, Deposition, CMP, etc.) and/or advanced packaging technologies and formats (FOWLP, FCBGA, SiP, RDL, 3
  
  DIC, HBM). Direct experience with FOWLP, TSV, bonding preferred.
• Expertise in wafer-level packaging, 2.5D/3D IC integration, advanced substrates, thermal/mechanical reliability, and/or heterogeneous integration.
• Demonstrated ability to engage with customers at executive and technical levels to shape joint technology roadmaps.
• Experience leading multi-disciplinary teams across the organization and complex technology programs.
• Understanding of existing and evolving advanced packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
• Wafer and package processing tools and metrology knowledge/experience.
• Working knowledge of materials characterization and analysis.
• Working knowledge of wafer bumping, solder sphere transfer / ball drop processing or packaging lines.
• Experience with data gathering (e.g. queries), processing, and statistical analysis and control.
• Experience in low volume/high product mix environments.
• Expert in DOE, SPC, and 6-sigma concepts and applications.
• Demonstrated experience deploying structured problem-solving (A3/8D, DMAIC) at scale and leading continuous improvement systems.
• Strategic thinker with ability to connect technology direction to business value.
• Strong program management, budget ownership, and operational excellence mindset.
• Excellent communication, collaboration, and executive presence.
• Clear problem-solving, data driven, and inventive solution oriented capabilities and can articulate thought processes.
• Proven ability to…