Process Engineering Manager - Molding, Ball & Die Attach, Bonding, Wet Etch and Cleans

Process Engineering Manager

Bold Thinking. World Changing. At Sky Water, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location — employees join together to improve the world. Explore what's possible. Joining our U.S.

- based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning "science fiction" into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few.

Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services. Step into the future. Sky Water's values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees — and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.

Are you bold thinking? Find your place on our team and help us change the world!

Position Summary:

The Process Engineering Manager – (Molding, Ball & Die Attach, Bonding, Wet Etch and Cleans) leads a team of process engineers and technical contributors responsible for wafer fabrication process development, sustaining, yield improvement, and technology transfer activities across assigned modules. This role provides senior technical and people leadership across thin films, dry etch, wet etch, cleans, plating, electrochemical processing, and related metrology in a cleanroom manufacturing environment.

Primary Scope:
Molding, Ball & Die Attach, Bonding, Wet Etch and Cleans, related metrology, module-level integration support, process control, sustaining, development, qualification, and transfer.

Major Area of Accountability:

• Lead the engineering team through clear goals, strong performance management, coaching, development, and succession planning.
• Build and grow technical capability by strengthening process ownership, enabling knowledge sharing, and delegating meaningful technical responsibilities.
• Drive process development, optimization, qualification, and sustaining across molding, attach, bonding, wet etch, cleans, and related metrology processes.
• Lead root ‑ cause investigations, corrective actions, and yield/defect improvements using rigorous statistical, DOE, and process ‑ capability methods.
• Partner cross ‑ functionally to resolve complex technical issues, support new technology introductions, ensure compliance, and clearly communicate priorities, risks, and resource needs to leadership.

Required Qualifications:

Education

• B.S., M.S., or Ph.D. degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, or another relevant engineering discipline.

Experience and/or Training

• Minimum of 15 years of experience in a wafer fabrication cleanroom environment.
• Minimum of 2 years of leadership, supervisory, or management experience, preferably with direct people leadership responsibility.
• Experience as a process or area owner for at least two relevant process areas such as Molding, Ball & Die Attach, Bonding, Wet Etch and Cleans related module processes.
• Experience working in CMOS, MEMS, photonics, photovoltaic, or heterogeneous integration / advanced packaging fabrication environments.
• Demonstrated experience leading structured problem-solving efforts using 8D, 3D, Fishbone, 5 Why, fault-tree analysis, or similar methodologies.
• Strong working knowledge of DOE, SPC, process capability analysis, and statistical methods, with the ability to teach and lead others in their application.
• Demonstrated…