Advanced Packaging Lamination & Bonding Engineer

Advanced Packaging Laminate and Bonding Process Engineer

Bold Thinking. World Changing. At Sky Water, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location — employees join together to improve the world. Explore what's possible. Joining our U.S.

- based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning "science fiction" into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few.

Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services. Step into the future. Sky Water's values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees — and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.

Are you bold thinking? Find your place on our team and help us change the world!

Position Summary:

We are looking for a hardworking, passionate, and experienced Advanced Packaging Laminate and Bonding Process Engineer for our Florida Advanced Packaging site. This role will focus on Bonding and Lamination areas with owning and developing one or more critical process areas within our Advanced Packaging flow. Candidates with experience in semiconductor manufacturing, backend-of-line processing, or advanced packaging are well suited. In this role, you will lead, develop, and improve integrated process flows and collaborate closely with foundry customers, colleagues, and management.

Strong communication skills are essential.

Major Area of Accountability:

• Lead new process development, transfer, and integration activities in a manufacturing environment.
• Develop, optimize, and integrate robust manufacturable process recipes for Foundry customers in one or more key process areas.
• Provide technical ownership for the assigned module, including process stability, tool performance, defectivity, consumables evaluation, and continuous improvement.
• Support process integration for advanced packaging, MEMS, Photonic, or backend-of-line device flows.
• Utilize metrology and characterization tools to evaluate process conditions and drive improvements.
• Investigate and implement integration or process-flow changes to improve device performance, reliability, and yield.
• Work with process and equipment engineers to identify processing marginalities and implement corrective actions.
• Monitor in-line and end-of-line SPC charts for trends/excursions and drive data-based corrective actions.
• Support improvement of electrical test para metrics through process/integration modifications.
• Opportunity to grow toward Project Management responsibilities, integrating customer device or process requests.
• Perform other duties as assigned. Percentages of time spent on specific job duties may vary.

Required Qualifications:

Education:

7-10 years experience with BS, 5-7 years experience with MS, 2+ years experience with PhD

Experience and Skills:

• Hands-on experience with fab processing tools in advanced packaging process area.
• Prior experience working with wafer bonding and metal carrier / RDL laminate.
• Develop and optimize materials and process recipes for wafer bonding and laminate steps to enable next-generation advanced packaging.
• Knowledge of MEMS/Photonic devices or backend-of-line integration is a plus.
• Strong understanding of DOE, SPC, and 6-sigma concepts and their application.
• Clear, data-driven problem-solving capability with strong communication…