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Advanced Packaging Engineer Security Clearance
Job in
La Canada Flintridge, Los Angeles County, California, 91011, USA
Listed on 2026-02-21
Listing for:
Zachary Piper Solutions, LLC
Full Time
position Listed on 2026-02-21
Job specializations:
-
Engineering
Systems Engineer, Electrical Engineering
Job Description & How to Apply Below
Piper Companies is looking for an Advanced Packaging Engineer to join a cutting-edge startup developing advanced hardware and system technologies that eliminate bottlenecks in large-scale AI computing. The ideal Advanced Packaging Engineer will lead advanced component and system-level packaging efforts, with a strong emphasis on module integration and organic substrate technologies on site near San Jose, CA. Responsibilities for the Advanced Packaging Engineer:
* Lead packaging development for single-chip (flip-chip) and multi-component module assemblies
* Drive system integration for full module builds (wafer + cold plate + multi-chip packages)
* Collaborate directly with Taiwan subcontractors and OSAT partners on assembly, manufacturing, yield, and module-level improvements
* Support substrate technology development and work closely with internal and external teams to refine organic substrate design and production Qualifications for the Advanced Packaging Engineer:
* 10+ years of experience as an advanced packaging engineer, module integration engineer, or similar role
* Must be eligible to work in the United States and obtain and maintain an Active U.S. Government Secret Clearance
* Strong background in organic substrate technology
* Experience with CoWoS, 2.5D packaging, and system-on-wafer programs involving TSMC
* Hands-on experience working with OSATs and Taiwan subcontractor engagement
* Understanding of multi-layer substrate concepts and module yield improvement strategies
* Bachelor's, Master's, or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, or related field Compensation/Benefits for the Advanced Packaging Engineer:
* Salary/Rate Range: $210,000 - $265,000 plus stock depending on experience
* Comprehensive Benefits:
Medical, Dental, Vision, 401K, PTO, Sick Leave (as required by law), and Holidays This job opens for applications on 2/20/2026. Applications for this job will be accepted for at least 30 days from the posting date. , 2.5D, 3D packaging, TSMC system-on-wafer, OSAT, Wistron, module integration, cold plate integration, wafer-level assembly, substrate technology, semiconductor packaging, high-density interconnect, HDI substrates, yield improvement, semiconductor manufacturing, module engineering #LI-BR1 #LI-ON SITE
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