Manufacturing Technician-Manual Wedge Bonder

Manufacturing Technician

We are seeking a detail-oriented and technically skilled Manufacturing Technician to join our Discrete Products Group (DPG) component manufacturing department in Lawrence, MA. The ideal candidate will have experience in automatic or manual aluminum wire bonding techniques and semiconductor manufacturing processes. You will play a crucial role in the production of our high-quality electronic components, ensuring that our products meet the highest standards.

Essential Duties And

Job Responsibilities:

• Operate wire bonding machines and equipment with precision and according to standard operating procedures.
• Perform manual wire bonding tasks as needed, utilizing microscopes and bonding tools.
• Inspect and test wire bonds to ensure quality and compliance with specifications.
• Troubleshoot wire bond equipment and process issues, implementing corrective actions to minimize downtime.
• Maintain accurate records of production data, process adjustments, and equipment maintenance.
• Collaborate with engineering and quality assurance teams to improve wire bonding processes and product quality.
• Adhere to cleanroom protocols and safety guidelines to maintain a safe and efficient work environment.
• Participate in continuous improvement initiatives and training programs to enhance technical skills and knowledge.
• Assist in the training of new technicians and support staff as required
• Perform other tasks and assist with various projects as needed.
• Good computer skills are required to support retrieval of drawings and work instructions as well as other job activities.
• Good interpersonal, teaming and communication skills

Requirements/

Qualifications:

• High school diploma or equivalent; technical degree or certification in electronics, microelectronics, or a related field is preferred.
• Minimum of 2 years of experience in a wire bonding or semiconductor manufacturing role.
• Proficiency with automated wire bonding machinery and manual wire bonding techniques.
• Strong understanding of microelectronics and the ability to work with delicate components.
• Ability to read and interpret technical drawings and process specifications.
• Excellent manual dexterity and hand-eye coordination
• Excellent visual capability to work with extremely small die, without magnification devices.
• Experience using tweezers, vacuum pencils, etc.
• Strong problem-solving skills and attention to detail.
• Ability to work in a fast-paced, team-oriented environment.
• Good communication skills, both written and verbal.

U.S. Export Controls Requirements:
This job requires access to technology, materials, software or hardware that is controlled by the export laws of the United States. Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3).

Travel Time:

No Travel

Physical Attributes:

Carrying, Crouching, Feeling, Foot Controls, Handling, Hearing, Kneeling, Lifting, Noise and/or vibration, Other, Pulling, Pushing, Reaching, Seeing, Talking, Works Alone, Works Around Others

Physical Requirements:

Able to lift, push, pull 25 lbs; carry 15 lbs; sit 10%; stand 60%; walk 40%; must be able to perform activities that include stooping, reaching, handling, hearing, talking, seeing, work alone, work around others.

Pay Range:

The hourly pay range for this position, which could be performed in the US, is .*

* Range is dependent on numerous factors including job location, skills and experience.

Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.