Wet Process Development Engineer

Position: 7095 - Wet Process Development Engineer
Wet Process Development Engineer

Advanced Semiconductor Manufacturing | 28nm SiGe Technology

Overview

SiGe strained channel and silicided contact integration at 28nm demand wet etch and clean chemistries with nanometer-level precision-removing exactly the right material, with exact selectivity, without disturbing adjacent films or device structures.

These processes are not yet fully production-ready. You will build them.

As a Wet Process Development Engineer, you will own the development, integration, and qualification of wet etch and clean modules for 28nm SiGe and silicidation device flows-directly enabling the transition from technology development to high-volume manufacturing.

Your work spans the full lifecycle: from chemistry formulation through module integration, yield optimization, and production readiness. The processes you develop will run on every wafer in manufacturing.

Key Responsibilities

Module Integration

• Develop and optimize wet process flows for SiGe epi-layer cleaning
• Enable selective material removal without damaging underlying silicon or gate oxide

Selective Etching

• Define chemistries for high-precision isotropic and anisotropic etching
• Optimize selectivity across SiGe, Si, and silicided films
• Control undercut and profile behavior at 28nm geometries

Yield & Defectivity

• Identify root causes of defects using FMEA and 8D methodologies
• Implement Statistical Process Control (SPC) to support yield ramp

Cross-Functional Collaboration

• Partner with Epi, Lithography, Spacer Films, and CMP teams
• Ensure seamless integration across the full fabrication flow

Metrology & Characterization

• Use SEM, TEM, ellipsometry, and AFM to evaluate surface roughness and etch profiles at atomic resolution

What It Takes

This role requires the ability to:

• Manage multiple parallel work streams under tight timelines
• Lead technical discussions with authority
• Clearly communicate risks, tradeoffs, and progress
• Drive alignment across cross-functional engineering teams

Qualifications

Minimum Requirements

• Master's or Ph.D. in Materials Science, Chemical Engineering, Electrical Engineering, Physics, or related field
• 5+ years in semiconductor R&D or advanced wafer fabrication (28nm or below)

Techical Expertise In:

• SiGe device physics, surface preparation, and reaction kinetics
• Wet etch and clean chemistries across multiple film types
• Hands-on experience with wet process tools (LAM, TEL, SCREEN, or equivalent)
• Design of Experiments (DOE) methodology
• Driving process development from concept to production

Preferred Qualifications

• Experience building wet process modules from the ground up
• Strong correlation between inline data and end-of-line electrical results
• Ability to influence and collaborate across internal and external stakeholders
• Strong written and verbal communication skills
• Proven ability to ramp quickly on new technologies and systems

Why This Role

• Direct impact on yield, device performance, and manufacturing success
• Ownership of critical process modules used on every wafer
• Exposure to advanced node integration challenges
• High visibility across process, device, and manufacturing teams