Digital Failure Analysis Engineer; R&D

Overview

As an Electrical Failure Analysis (EFA) Engineer, you will perform various electrical investigative work on defect, performance and design-related issues during the technology development phase pertaining to a broad range of products in order to deliver qual-capable and high-yielding devices. This position also requires the ability to develop testing algorithms to successfully segment various electrical failures. You will also be adhering to all lab safety guidelines.

• Failure Data Analysis and Diagnosis:
  Collect and analyze debug data from both internal FA test capability and collaboration with Test Engineering using memory mapping and ATPG diagnostic tools to identify failure signatures and guide root-cause investigation.
• Electrical Failure Analysis:
  Perform electrical failure characterization using production and custom test patterns in a bench test environment to isolate failing circuitry and determine defect mechanisms across wafer yield investigations, qualification issues, quality excursions, and customer returns.
• Cross-Functional Debug and Physical Correlation:
  Work with Test Engineering, design teams, and Physical Failure Analysis (PFA) laboratories to correlate electrical failure signatures with physical defects and enable defect isolation.

• Bachelor's degree in Electrical Engineering or Electrical and Computer Engineering
• 5+ years of experience performing electrical failure analysis on semiconductor devices

• Strong understanding of semiconductor fabrication processes
• Excellent technical, communication, and analytical skills
• Experience in interpreting SEM/TEM/FIB/EDS/EELS images and analysis results
• Experience in interpreting scan test data and shmoos
• Familiarity with digital circuit operation and scan-based test methodologies
• Experience using electrical failure analysis techniques such as photon emission analysis, laser-assisted fault isolation, waveform acquisition, or similar FA instrumentation
• Experience with digital IC design, mixed-signal IC design, or related design environments
• Familiarity with memory mapping tools, ATPG diagnostics like Cadence Modus and Synopsys Tetramax and Avalon layouts
• Ability to work collaboratively across engineering teams including design, test, failure analysis, and manufacturing/process development groups