LFAB Yield Ramp; 28nm Branch Manager

Change the world. Love your job.

TI is seeking a leader to work in a state‑of‑the‑art, growing 300mm, 65nm, 45nm and 28nm analog and embedded wafer fab in Lehi, Utah.

In this role you will be part of the factory leadership and lead the activities ramp our latest 28nm technology to yield entitlement. Primary responsibilities will include (a) ownership of parametric performance and yield improvement, (b) driving execution to enable yield entitlement (c) leading the yield ramp team, device improvement activities, integration projects to support increased yield and product performance, (d) working closely with the factory leadership team to meet strategic technology goals, (e) leading the factory in finding effective solutions to 28nm technology issues and yield improvement in a time constrained environment, (f) utilizing technical and practical experience to drive factory quality decisions and actions, (g) leveraging experience and management skills to ensure technology transfers and development meet commitments, (h) partnering with factory leadership to define and execute strategic roadmaps.

As part of this role, you will have director level responsibilities and direct responsibility for continued improvement of the process integration team’s effectiveness. As the 28nm Yield Ramp Manager you are expected to be highly experienced in high volume yield ramps and process integration as you will be required to both drive decisions and coach factory team members at all levels in integration, project execution, and continuous improvement.

You will be expected to present and show your progress to senior level TI leadership.

Demonstrated

Qualification:

• Effective director level leadership (experience leading managers and individual contributors):
  
  Defining and meeting aggressive goals, strategic and tactical execution, team development
• Effective communication to senior management and overall organization
• Strategic planning in a combined volume semiconductor manufacturing and new technology introduction environment
• Leading technology development and transfer activities, both technical and execution
• Day to day leadership in a fast paced, 24x7 manufacturing site with a rapidly changing environment.
• Practical understanding of semiconductor device physics
• Ownership of semiconductor device characterization and manufacturing parametric data, and yield.
• Practical understanding of 28nm process integration
• Experience in 28nm and below process technology nodes
• General knowledge of unit process physics and manufacturing operations
• Strong analytical and problem‑solving skills
• Strong verbal and written communication skills
• Ability to work in teams and collaborate effectively with people in different functions
• Demonstrated ability to build strong, influential relationships
• Work effectively across organizational boundaries, fab sites, development teams, business units

Yield Ramp Manager Responsibilities:

• Deliver on an aggressive yield ramp schedule.
• Leadership team member responsible for “24x7” volume manufacturing fabrication facility
• Proactive alignment and communication with factory leadership team
• Define and set yield ramp team goals to support factory level goals
• Deliver on daily tactical program priorities (rapid learning execution)
• Deliver on strategic factory priorities
• Identify and drive longer term company technology and manufacturing group initiatives
• Define, initiate and implement strategic initiatives to impact factory and TI technology and manufacturing group performance
• Optimize the team and factory organization to its most effective state, with ongoing reassessment
• Leadership in technology transfer and development activities including project execution, technical assessment, and communications
• Plan effectively, drive schedules, meet critical deadlines on multiple projects in parallel
• Coach and develop leaders and team in technical understanding, management, and project execution
• Lead and drive technical discussions around the performance of a broad portfolio of semiconductor components
• Lead and drive technical discussions around the process integration at 28nm.
• Lead and coach team in critical, high pressure, time constrained technical…