Electronic Board Design Engineer

Description

Location: Lenexa, KS (onsite with hybrid flexibility). Relocation assistance available.

As a Board Designer, you'll design and develop advanced embedded hardware that powers next-generation avionics and autonomous aerospace systems. You'll play a key role in delivering complex electronic designs from concept through production while collaborating closely with hardware, FPGA, embedded software, and manufacturing teams.

Guide Tech is a subsidiary of Palladyne AI (NASDAQ: PDYN), a U.S.

-based defense and industrial technology company that delivers embodied AI-powered collaborative autonomy solutions, advanced avionics, precision-manufactured components, UAVs, and advanced aerospace design services.

At Guide Tech, you'll contribute to technologies that support a diverse range of aerospace and defense platforms, including unmanned aircraft, launch vehicles, spacecraft, missiles, and other autonomous systems. You'll have the opportunity to work on our next generation of embedded hardware, including electronic speed controllers (ESCs), gimbal controllers, UAV power distribution boards, and advanced AI/computer vision platforms. As the role evolves, you'll lead new board designs from concept through manufacturing, helping bring innovative products into production.

You'll thrive in this role if you enjoy solving complex hardware challenges, collaborating across engineering disciplines, and seeing your designs progress from initial concept to deployed hardware.

• Hardware Design
• Design and develop complex multilayer PCBAs/CCAs for advanced UAV, aerospace, and AI platforms.
• Create schematics, define design constraints, support PCB layout, participate in design reviews, and prepare designs for release.
• Design embedded hardware systems with a focus on performance, reliability, manufacturability, and testability.
• Work with FPGA-based systems, including hardware integration, timing constraints, debugging, and system validation.
• Support board bring‑up, debugging, and signal analysis using lab instrumentation and simulation tools.
• Collaborate closely with hardware, FPGA, and embedded software engineers to develop reliable real‑time systems.
• Lead hardware development efforts from concept through production for new board designs.
• Support the transition from prototype to production, including fabrication and assembly documentation, impedance requirements, and production test planning.
• Apply Design for Manufacturability (DFM) and Design for Test (DFT) best practices throughout development.
• Partner with PCB fabrication vendors and contract manufacturers to improve manufacturability, quality, and production readiness.
• Develop and support production test methodologies, fixtures, and functional testing.
• Perform failure analysis, root‑cause investigations, and yield improvement activities.
• Manage engineering change notices (ECNs), product revisions, and hardware lifecycle documentation.

• You communicate effectively across engineering disciplines and enjoy collaborating with multidisciplinary teams.
• You take ownership of your work and follow projects through from concept to production.
• You balance technical detail with practical engineering judgment.
• You enjoy solving complex hardware challenges and continuously improving designs.
• You adapt well to evolving priorities while maintaining a high standard of quality.
• You value integrity, accountability, and open communication.
• You are motivated by building technology that supports meaningful aerospace and defense missions.

• Proven experience designing and releasing complex multilayer PCBAs/CCAs into volume production.
• Strong experience with high‑speed, mixed‑signal, and embedded hardware systems.
• Deep understanding of Design for Manufacturability (DFM), Design for Test (DFT), manufacturing processes, and production test strategies.
• Experience working directly with PCB fabrication vendors, contract manufacturers, and fabrication/assembly documentation.
• Familiarity with failure analysis, root‑cause investigation, and yield improvement.
• Experience with FPGA SoCs (such as Zynq), Vivado, hardware integration, simulation, and on‑chip…