Process Engineer

Job Description

Insight Global is seeking a Staff Process Engineer to support and improve semiconductor manufacturing and assembly operations. This individual will serve as the technical expert responsible for troubleshooting production issues, identifying root causes of manufacturing challenges, and driving continuous improvement initiatives that improve yield, quality, productivity, and cost. The engineer will work closely with manufacturing, quality, suppliers, and external assembly partners (OSATs) to optimize backend semiconductor assembly and screening processes.

In addition, they will support new product introductions (NPI), helping transition products from R&D through pilot builds into high-volume manufacturing while developing long-term process technology roadmaps for future products. The ideal candidate is a hands‑on engineering leader who is comfortable working on the manufacturing floor, leading cross‑functional projects, mentoring engineers and technicians, and utilizing Lean Manufacturing and Six Sigma methodologies to drive operational excellence.

We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment regardless of their race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances.

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• Bachelor's degree in Engineering (Mechanical, Manufacturing, Materials, Chemical, Electrical, Electronics, or similar).

• • years of Process Engineering experience in a high-volume manufacturing environment.

• Strong experience with semiconductor backend manufacturing, semiconductor assembly, packaging, or electronic assembly processes.

• Hands‑on experience with root cause analysis and process improvement methodologies, including:

• • 8
    
    DFMEA (DFMEA/PFMEA)
    DOEStatistical analysis
    
    Control PlansOCAP
  • Experience leading Lean Manufacturing and/or Six Sigma projects.
  • Experience supporting New Product Introduction (NPI) and transferring products into manufacturing.
  • Semiconductor package engineering experience.

• Experience working with OSATs (Outsourced Semiconductor Assembly and Test providers).

• Lean Six Sigma certification.

• Experience with APQP and advanced quality tools.

• Familiarity with material characterization and qualification methods.

• CAD experience and ability to interpret mechanical drawings.

• Knowledge of military, aerospace, or high‑reliability manufacturing standards.