U109 Solid State Technician - 3rd Shift - R10186512
Listed on 2026-04-17
-
Engineering
Electrical Engineering
- Location: Linthicum, Maryland, United States of America
- Clearance Type: Secret
- Telecommute: No - Teleworking not available for this position
- Shift: 3rd Shift (United States of America)
- Travel Required: No
- Relocation Assistance: Relocation assistance may be available
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history. We look for people who have bold new ideas, courage, and a pioneering spirit to join forces to invent the future, and have fun along the way.
Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work.
Northrop Grumman Mission Systems is seeking Solid State Technicians to join its organization. This position is located in Linthicum, MD.
Primary Functions:
Solid State Technicians perform a variety of processes to support the development, fabrication, testing, and assembly of semiconductor devices in accordance with operational goals. They are responsible for the setup, operation, and adjustment of a variety of process and measurement tools to support integrated circuit production and engineering development efforts. They may be asked to perform process calculations, summarize data, prepare basic reports, and maintain electronic data logs for engineering staff.
Solid State Technicians must adhere to all safety policies and maintain a clean, orderly work area at all times.
Specific Process Areas:
- Chemical Mechanical Planarization (CMP):
Using a combination of chemical reactivity and mechanical forces to remove excess material from the surface of a wafer with high precision and uniformity. - Chemical Vapor Deposition (CVD):
Creating high quality, high performance thin films where a volatile precursor gas reacts with the wafer/substrate surface in a chamber. - Diffusion
:
Using high temperature furnaces to drive species into the substrate or to create thin interfacial layers by introducing a gas or solid source material to modify electrical properties. - Dry Etch
:
Removing material deposited onto wafers by using reactive ion etching (RIE) for anisotropic removal or through inductively coupled plasma (ICP) etch for isotropic removal of material. - Implant
:
Changing physical, chemical, or electrical properties of a substrate by accelerating and bombarding ions of a particular element into the wafer at a high energy. - Metal Deposition
:
Metallic films can be deposited onto substrates using a variety of techniques including sputter physical vapor deposition (PVD), electron beam PVD, thermal evaporation, and electroplating. - Photolithography
:
Patterning onto the surface of a wafer by exposing a specific wavelength of light through a photo mask onto a photosensitive material spun onto the wafer surface. - Clean / Wet Etch
:
Cleaning substrates before a sensitive downstream process step or stripping undesirable films from surfaces through isotropic wet etch processes. - Pre-Assembly
:
Wafer bonding, lapping, polishing, grinding, taping, and sawing processes that are performed in advance of moving wafers to the assembly area. - Metrology / Inspection
:
Monitoring of critical product specifications including critical dimensions, overlay, film thickness, particle adders, sheet resistance, or other optical defects.
- DC / Parametric Testing
:
Recording electrical parameters of unit cells and subsets of active circuitry to evaluate and monitor the performance of various technologies as an early screening test for final test and yield prediction. - Application Specific Integrated Circuit (ASIC) Test
:
Functional electrical test using a wide variety of test systems, wafer probers, and test hardware to quantify electrical performance of analog, digital, and memory circuits on product wafers and packaged parts. - Radio Frequency Monolithic Microwave Integrated Circuit (RF MMIC) Test
:
Functional electrical test using various probers and test instrumentation to measure electrical RF parameters such as microwave mixing,…
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