Microelectronics Packaging Engineer; Level 3

RELOCATION ASSISTANCE:
Relocation assistance may be available

CLEARANCE REQUIRED FOR START:
No

CLEARANCE TYPE: SCI

TRAVEL:
Yes, 10% of the Time

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon.

We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they’re making history.

Northrop Grumman Space Systems continues to push the boundaries of what is possible in space technology. Join our collaborative team of passionate engineers designing and building mission‑critical space sensor payload hardware enabling national security and scientific advancements. We foster a culture where your expertise is valued and your growth is supported every day through purposeful innovation and leadership.

We seek an experienced Electro‑Mechanical Engineer (level 3/4) to join our team within the Intelligence Systems Business Unit. The successful candidate will independently lead mechanical design, analysis, integration, and testing for RF and EO aperture designs supporting multiple high‑profile satellite programs. This role is ideal for a technically accomplished and strategic engineer who thrives in fast‑paced, multidisciplinary environments and is eager to take leadership responsibility.

This role will be worked out of Linthicum, MD
.

The ideal candidate will support development, design, fabrication, and test of various space sensor hardware work products across different program efforts. The qualified candidate will work with a diverse and talented team of engineers developing innovative and cost‑effective systems that support a broad range of products and business areas across the lifecycle of a program. The candidate will support the design of space hardware and specifically support the mechanical development of micro‑circuit technology.

The micro‑circuit technology will support equipment for antennas, electro‑optical sensors, and supporting electronics chassis assemblies such as processors and receivers. The candidate will specifically be involved with micro‑electronic devices that are used on tile sensor assemblies as well as circuit card assemblies. The role will also provide an opportunity to be involved with proposals of new space sensors designs and development of payload sensor components that comply with a multitude of customer mechanical requirements.

This position is targeted for micro‑circuit development ; however, the candidate will have exposure to broader aspects of the overall sensor and system design. A candidate applying to the position would benefit from having prior experience supporting micro‑electronic designs, designing for the consideration of space environments, and specifically space sensor elements such as tile assembly development. This position will report to the Electro‑Mechanical Design manager of the Mechanical Systems Technology Department within Hardware Engineering.

Minimal travel is expected.

• Responsible for the mechanical development of advanced micro‑circuit design as well as the assemblies that they support. (Ex. RF Tile Assemblies)
• Responsible for the development of microcircuit advancements that are funded by internal NGC IRAD
• Understanding of all aspects of hardware development. This will encompass all phases of design, including concept and detailed design development, CAD modeling efforts, documentation release, fabrication, integration, factory support and testing
• Responsible for understanding technical…