Thermal Engineer

Your Job

We are seeking a passionate and skilled Thermal Engineer to perform thermal simulations and experimental testing for datacom interconnect products. This role focuses on advancing electronics cooling through research and development of innovative thermal management solutions.

You will play a key role in shaping next‑generation Molex datacom products by developing novel simulation methodologies and driving new approaches to thermal design.

You may not see our name on the shelves, but our electronic solutions are inside the products you use every day. We work together with the world's innovators to design and manufacture electronic solutions that solve complex technical challenges.

At Molex, we not only employ some of the most talented people from all over the world, we work to help cultivate tomorrow's breakthroughs. From our corporate headquarters in Lisle, IL to manufacturing floors around the world, the Molex team is dedicated to helping further the limits of technology.

• Discover and invent new techniques and methods in thermal simulations, design, and test.
• Lead the development of new products and direct the activities of multifunctional team(s) according to the priorities set by engineering management.
• Conduct analytical and numerical analyses to evaluate interconnect thermal management systems.
• Develop documentation of thermal testing and simulation best practices and procedures.
• Recommend changes in designs or technical procedures.
• Provide input, ideas, and suggestions to create effective thermal design guidance and documentations.
• Work in laboratory environment to validate thermal designs and correlate thermal simulations with experimental data.
• Publish technical papers and patents.

• Bachelor's degree in Thermal, Mechanical, or related Engineering discipline.
• 1+ years of Thermal or Mechanical Engineering experience.
• 1+ years of experience with thermal and CFD simulation software such as ANSYS Fluent, ANSYS Icepak, AEDT Icepak, or equivalent.
• 1+ years of experience with 3D CAD systems (NX, CATIA, Solid Works, etc.)
• Prior experience with prototyping and fixture design to support product development and testing.

• PhD or Master's in Thermal, Mechanical, or related Engineering discipline.
• 3+ years of Thermal or Mechanical engineering experience.
• 1+ years of thermal testing experience and familiarity with DC axial fans, heat pipes, cold plates, thermal interface materials, and heat sinks.
• Experience with testing and simulation of two‑phase cooling systems.
• Prior experience with design and development of electronics cooling solutions.
• Experience with writing Fluent UDFs and Python scripting.
• Experience with joule heating simulations.
• Established records of inventions, such as patent ownership or technical paper authorship.

For this role, we anticipate paying $80,000 - $120,000 per year. This role is eligible for variable pay, issued as a monetary bonus or in another form.

At Koch companies, we are entrepreneurs. This means we openly challenge the status quo, find new ways to create value and get rewarded for our individual contributions. Any compensation range provided for a role is an estimate determined by available market data. The actual amount may be higher or lower than the range provided considering each candidate's knowledge, skills, abilities, and geographic location.

If you have questions, please speak to your recruiter about the flexibility and detail of our compensation philosophy.

All Koch companies value diversity of thought, perspectives, aptitudes, experiences, and backgrounds. We are Military Ready and Second Chance employers.

Learn more about our hiring philosophy here.

As a Koch company, Molex is a leading supplier of connectors and interconnect components, driving innovation in electronics and supporting industries from automotive to health care and consumer to data communications. The thousands of innovators who work for Molex have made us a global electronics leader. Our experienced people, groundbreaking products and leading‑edge technologies help us deliver a wider array of…