ElectroMechanical Packaging Engineer II

Description

Fleet Ballistic Missile Avionics team is seeking an experienced Electronics Packaging Engineer who will work closely with senior engineers to develop preliminary 3D concept models of space flight avionics hardware and ultimately advance them for flight use.

This position does not support teleworking; you will be located near our Lockheed Martin Space facility in Littleton or Englewood CO and be expected to work a flexible 9x80 schedule in the office full-time.

• Support trade studies on electronic enclosure design approaches and provide technical data for informal and formal design review documentation and presentations.
• Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs; support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems.
• Establish specifications for contract assemblers and raw‑material vendors; interface with Parts Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance.
• Provide producible designs that meet technical, cost, and schedule requirements, and work within an Integrated Product Team environment.
• Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed.

• Identify initial physical architecture for the Avionics subsystem.
• Assist with R&D trade studies for Pre‑SRR design phase.
• Assist with defining the requirements and provide the framework for architecture and interface development & maintenance throughout the program lifecycle.
• Generate and release design disclosure artifacts including technical presentations and end‑of‑year reports.
• Work on a cross‑functional team in the development and integration of world‑class avionics systems.
• Develop electronic enclosure designs, performance and test requirements, and stress and thermal analysis.
• Participate in iterative design reviews, Engineering Material Review Board (EMRB) hardware discrepancy decisions and Failure Review Board (FRB) as required.
• Resolve test anomalies and support system‑level testing.

• 1+ years professional experience.
• While no clearance is needed to start, you will need to obtain and maintain a DoD Top‑Secret clearance, thus US Citizenship is required.

• Bachelor of Science or higher from an accredited college in Mechanical or Aerospace Engineering or related discipline, or equivalent experience/combined education.
• Full working knowledge and experience with Geometric Dimensioning and Tolerancing (GD&T).
• CAD modeling and drafting experience (CREO, Solid Works and/or similar CAD data modeling experience, model based engineering).
• Willing and able to obtain and maintain a DoD Top‑Secret clearance, thus US Citizenship is required.

• Experience with CCA package design (IDX files, board outlines, connector selection, artwork review, component mounting, cooling techniques).
• Working knowledge EPDM tools or equivalent.
• Exposure to DFx Principles (Design for Affordability, Design for Manufacturability, etc.).
• Experience with 3D printing/prototyping.
• Missile/Aerospace related experience.
• Proficiency in Microsoft Office Software (Word, Excel, MS Project, PowerPoint).
• Familiarity with FBM specifications/procedures.
• Familiarity and experience partnering with SP/SPF Customer Partners.
• Experience with QNotes (SAP/ERP), PMP Database, FAST Items, DaSI, and FBM Web (Livelink).
• Previous MRB experience.
• Ability to communicate issues and additional resource needs to leadership.
• Experience with subcontracted hardware suppliers.
• Experience performing tolerance stack‑ups.
• Demonstrated ability to collaborate effectively within a team environment and with adjacent disciplines.
• Excellent communication, presentation and interpersonal skills with technical and non‑technical audiences including design reviews (SRR, PDR, CDR, etc.).
• Hands‑on hardware experience.

This position requires a government security clearance; you must be a US Citizen for consideration. Clearance Level: Top Secret.

Medical, Dental, Vision, Life Insurance, Short‑Term Disability, Long‑Term Disability, 401(k) match, Flexible Spending Accounts, EAP, Education Assistance, Parental Leave, Paid time off, and Holidays. Additional PTO policies for Washington state applicants as described.

Lockheed Martin is an equal opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics.

Experience Level: Experienced Professional

Business Unit: SPACE

Relocation Available:
Possible

Career Area:
Electronics Engineering

Type:
Full‑Time

Shift: First