ElectroMechanical Packaging Engineer III

Electronics Packaging Engineer – D5 Life Extension II Program

Join us at Lockheed Martin as an Electronics Packaging Engineer for the D5 Life Extension II program for avionics enclosure design and analysis.

Location:

This position does not support teleworking; the selected candidate will be located near our Lockheed Martin Space facility in Littleton or Englewood CO and be expected to work a flexible 9x80 schedule in the office full-time.

• Electronic packaging engineer for space flight applications, Geometric Dimensioning and Tolerancing (GD&T) and CREO and/or Pro‑E CAD design.
• Create 3D solid models in CREO of space flight avionics and power hardware.
• Perform electronic packaging design and provide technical data for informal and formal Design Review documentation and presentations.
• Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs.
• Support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems.
• Interface with Parts Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance.
• Provide producible designs that meet technical, cost, and schedule requirements, and work within an Integrated Product Team environment.
• Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed.

• 3+ years of professional experience.
• Full product life cycle experience.
• Knowledge of the definition, interpretation, and implementation of design requirements.
• Coordination and execution of hardware designs.
• Development and integration of hardware for both custom and procured electronic assemblies in accordance with Lockheed Martin Space engineering process specifications.
• Supported technical design review preparation.
• U.S. citizenship and ability to obtain and maintain a DoD Secret clearance.

• Bachelor of Science or higher in Mechanical Engineering or related discipline, or equivalent experience/combined education.

• Exposure to DFx Principles (Design for Affordability, Design for Manufacturability, etc.).
• Experience with 3D printing/prototyping.
• Experience with CREO CAD modeling and Zuken.
• Missile/Aerospace related experience.
• Proficiency in Microsoft Office Software (Word, Excel, MS Project, PowerPoint).
• Effective communication of issues and additional resource needs to leadership.
• Experience with subcontracted hardware suppliers.
• Experience performing tolerance stack‑ups.
• Collaborative teamwork with adjacent disciplines.
• Excellent communication, presentation and interpersonal skills with technical and non‑technical audiences including design reviews.
• Hands‑on hardware experience.
• Active security clearance.

This position requires a DoD Secret clearance; U.S. citizenship is required.

9x80 every other Friday off.

• Medical, Dental, Vision, Life Insurance, Short‑Term Disability, Long‑Term Disability, 401(k) match, Flexible Spending Accounts, EAP, Education Assistance, Parental Leave, Paid time off, and Holidays.

Annual base salary range: $89,300 - $157,550 (calculated by location). Salary is a general guideline.