Technology Leader, Advanced Product Engineering

Job Description

We are seeking a Director, Thermal Engineering leader to drive the development and delivery of advanced cooling solutions for probe card technologies. This role is responsible for defining the technical vision and roadmap for thermal solutions, leading multiple engineering efforts, and ensuring alignment with product, manufacturing, and business objectives.

• Lead the architecture, design, and development of cooling solutions for probe card technologies.
• Define and own thermal technology strategy and multi‑year roadmap aligned to business objectives.
• Lead, develop, and scale a team of engineers.
• Drive resource planning, prioritization, and organizational design to support product and technology goals.
• Establish and track business and engineering Key Performance Indicators (KPIs) and manage development programs using Product Life Cycle (PLC) methodology.
• Develop and evaluate new concepts for heat removal, temperature uniformity, and thermal stability.
• Ensure organization has the technical rigor to execute development and implementation of solutions for highly complex product and engineering challenges.
• Technically lead and/or execute engineering projects and spearhead research and development of new technologies, as appropriate.
• Lead escalation resolution for critical product and customer issues. Interface with internal and external stakeholders to resolve complex engineering issues and meet customer commitments.
• Collaborate with manufacturing to build prototypes, alpha and beta probe cards.
• Drive continuous improvement across development process, manufacturability, and reliability. Own delivery of complex programs including schedule, cost, and technical performance outcomes.

• MS or Ph.D. in Mechanical Engineering, or a related engineering field preferred; BS with significant relevant experience will also be considered.
• 10+ years of relevant experience in thermal management, electronics cooling, semiconductor equipment, or related advanced product development environments.
• Demonstrated success leading engineering teams in semiconductor, electronics cooling, or related industries.

3D Modeling, Agile Systems, AutoCAD 3D, Business Acumen, Communication, Computational Fluid Dynamics (CFD), Cross‑Functional Collaboration, Cross‑Functional Leadership, Engineering Leadership, Error Budgets, FEA Software, Geometric Dimensioning & Tolerancing (GD&T), Heat Transfers, Interpersonal Communication, Leadership, MATLAB, Problem Solving, Product Development, Python (Programming Language), Semiconductor Manufacturing, Solid Works, Technology Strategy Development, Thermal Management, Thermomechanical Processing.

Minimum of 12+ years of relevant experience in leadership roles, with a Bachelor’s degree; or 10 years and a Master’s degree; or a PhD with 8 years experience; or equivalent experience.

$ – $ per year.

Full benefits package including medical, dental, vision, life insurance, disability coverage, 401(k) with company match, employee stock purchase plan (ESPP), paid time off, quarterly profit‑sharing bonuses, flexible spending or savings accounts.

Form Factor is an equal opportunity employer. Form Factor complies with all national, state, and local laws that seek to promote equal opportunities for any applicant or employee without regard to age, race, color, gender, gender identity/expression, national origin, sexual orientation, religion, disability, marital status, pregnancy or related condition, military service, or any other legally protected characteristics. These protections apply to all aspects of employment, including but not limited to recruitment, hiring, training, promotions, and compensation.

For roles that are designated as remote‑eligible, employees cannot be located in: AL, AK, AR, DE, GA, HI, IL, IA, KY, LA, ME, MD, MS, MO, NE, NV, NJ, NM, ND, OK, PA, RI, SC, SD, TN, WV, WI, WY. This list is continuously evolving and being updated. A role is remote‑eligible only when it is listed as “Remote” in the job location.