Sr. Principal Plating Engineer
Job in
Livermore, Alameda County, California, 94551, USA
Listed on 2026-07-24
Listing for:
FormFactor, Inc.
Full Time
position Listed on 2026-07-24
Job specializations:
-
Engineering
Materials Engineering, Process Engineer, Quality Engineering, Manufacturing Engineer
Job Description & How to Apply Below
Livermore, CAtime type:
Full time posted on:
Posted Yesterday job requisition :
JR100817
** Forming Our Future together
** Form Factor, Inc. (NASDAQ: FORM), is a leading provider of essential test and measurement technologies along the full semiconductor product life cycle — from characterization, modeling, reliability, and design de-bug, to qualification and production test. Semiconductor companies rely upon Form Factor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge. The company serves customers through its network of facilities in Asia, Europe, and North America.
Rooted in our core values — Focus on the Customer, Ownership & Accountability, Respectfully & Effectively Communicate, and Motivate & Develop People — we foster an environment where diverse perspectives are not only welcomed but celebrated. Everyone can make an impact here. Whether it's improving products, supporting customers, or positively influencing peers and the community, the contributions of our people matter.
** Shift:
** The regular hours for this position are day shift.
*
* Job Description:
** The
** Sr. Principal Plating Engineer (MEMS R&D)
** serves as a recognized technical authority responsible for defining, developing, and implementing advanced electroplating technologies, metallurgical innovations, and process integration strategies for MEMS probe fabrication. This role combines deep expertise in electrochemistry, materials science, semiconductor processing, and advanced metallurgy with the ability to solve highly complex technical challenges that have significant impact on Form Factor's technology roadmap and competitive advantage.
As a senior technical leader, you will lead strategic R&D initiatives, drive innovation in electrode position and material development, influence product and process direction, and collaborate with cross-functional teams to enable next-generation probe card performance. This role requires the ability to balance long-term technology development with hands-on process characterization and problem solving.
*
* Key Responsibilities:
**** Technical Leadership & Innovation
*** Define and execute long-range technology roadmaps for advanced electroplating processes, materials, and metallurgical innovations supporting future MEMS probe technologies.
* Serve as the organization’s subject matter expert in electroplating, electroless deposition, electrochemistry, and metallurgical process development.
* Lead research, evaluation, and implementation of novel materials and deposition technologies to improve electrical, thermal, mechanical, and reliability performance.
* Assess emerging industry technologies and identify opportunities to create sustainable competitive advantages through advanced materials and plating processes.
* Generate intellectual property through invention disclosures, patent development, and technical innovation initiatives.
** Process Development & Characterization
*** Design and execute complex Design of Experiments (DOE) to develop and optimize advanced metallurgical solutions for MEMS probe fabrication.
* Develop, characterize, document, and scale electrode position processes for next-generation vertical probe technologies.
* Establish process windows, operating specifications, and control methodologies to ensure robust and repeatable manufacturing performance.
* Lead process integration efforts across MEMS fabrication workflows.
* Maintain expertise in plating bath chemistry, deposit morphology, stress management, grain structure control, and material performance optimization.
** Materials Analysis & Failure Investigation
*** Perform advanced materials characterization using SEM, EDS/EDAX, FIB, microscopy, and other analytical techniques.
* Analyze deposited metal structures to evaluate composition, microstructure, purity, and performance characteristics.
* Lead root cause investigations involving plating defects, process excursions, reliability concerns, and manufacturing challenges.
* Apply first-principles engineering and statistical methodologies to solve complex electrochemical and…
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