Integration Engineer - Compute and Connectivity
Listed on 2026-07-10
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Engineering
Systems Engineer, Electrical Engineering
At Ford Motor Company, we believe freedom of movement drives human progress. We also believe in providing you with the freedom to define and realize your dreams! With our ambitious plans for the future of mobility, we offer a wide variety of opportunities to accelerate your career potential as you help us define tomorrow’s transportation.
Ford Model e is responsible for developing key technologies and capabilities—such as EV platforms, batteries, e-motors, inverters, charging, and recycling—to create ground-up, breakthrough electric vehicles. By joining the industry's best software, engineering, design, and UX talent, you will help create new technologies and concepts applied across the Ford enterprise. Being part of the Ford Model e team means building the future as Ford’s center of innovation and growth through electric and connected vehicles and services.
As the Staff Integration Engineer
, you will act as the Component and Systems Integration Directly Responsible Individual (DRI) for Ford’s High-Performance Compute Cluster (HPCC), Telematics Control Unit (TCU), and related components. In this critical position, you will drive the development, integration, industrialization, and production readiness of these modules, while also participating in system-level design activities for related subsystems. Your leadership will span the entire product lifecycle—from early concept and architecture definition through validation, launch, and high-volume manufacturing—ensuring supplier execution and production processes meet Ford’s stringent quality, capability, and scalability standards.
You will act as the technical link between Product Development, Manufacturing, Quality, Purchasing, Software, Systems Engineering, and suppliers to ensure robust engineering principles are applied and launch timelines are met without compromise. You will be part of the teams that conceptualize, design, develop, integrate, and support the launch of next-generation compute and connectivity platforms for electric vehicles.
What you’ll be able to do:Component Ownership & Program Delivery
- End-to-End Module Ownership:
Spearhead the end-to-end engineering and development strategy for HPCC and TCU systems, containing multi-SoC compute platforms and wireless telematics (cellular, GNSS, Wi-Fi) to successfully transition designs to high-volume manufacturing. - Supplier Leadership:
Serve as the primary technical DRI for internal and external suppliers. Lead design reviews, manage Engineering Change Requests (ECRs), ensure validation testing and engineering deliverables are completed. - Validation & Quality:
Own the Design Verification Plan & Report (DVP&R), lead FMEA/risk assessments, and develop robust quality control measures and testing protocols.
- Requirements & Trade Studies:
Perform detailed trade studies, define interfaces, and cascade component functional/interface requirements to suppliers. Verify software behaviors, electrical characteristics, and network interfaces against specifications. - Testing & Issue Resolution:
Validate core functionality on bench, desktop, and lab-car environments. Serve as the single point of contact to troubleshoot and resolve complex electrical, hardware, and software issues during lab-car, prototype, and vehicle assembly/commissioning phases. - Software & Network Integration:
Validate software and electrical HW integration on-vehicle. Maintain and test ECU network interfaces (Ethernet, CAN, SPI, VLAN). - Diagnostics, Boot loader & Security:
Own DTCs, DIDs, UDS routines, and manufacturing diagnostics. Manage boot loader interfaces and cybersecurity-related integration requirements (CMA, Service 27 Security Access). - Plant & Service Interface:
Partner with manufacturing and plant engineering to define calibration routines, configuration writes, VIN consumption, in-line software updates, and in-station diagnostics for factory and dealer environments.
- Multi-SoC Compute Platform Design:
Lead the integration of a complex, liquid-cooled, dual-board housing containing high-performance application processors (x86/ARM), ADAS…
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