Senior RF Digital Payload Engineer I​/II Pipeline

Senior Digital Payload Engineer I/II Pipeline

Based onsite at Rocket Lab's global headquarters in Long Beach, CA, we are looking for a Senior Digital Payload Engineer I/II who will be responsible for the development of new digital payload products including modems, processors, and network routers. The Senior Digital Payload Engineer will take the design from initial concept through inflight operations including board layout, bring‑up, qualification, and production.

The successful candidate will have a strong combination of RF engineering, system design, and board/circuit design skills and will thrive in a fast‑paced, dynamic environment.

• Define and maintain requirements specifications
• Architect the digital product design
• Support the development process, ensuring key design decisions and developments are in alignment with the required product capabilities
• Design and prototype the digital product including component selection and PCB layout / fabrication / packaging
• Support the development of test plans and procedures
• Support the design and development of GSE and production automation
• Support the development of product documentation including ICDs and User Manuals
• Liaise with Test Engineers and Manufacturing Engineers to drive New Product Introduction

• Review proposals and requirements specifications to assess compliance based on existing unit capabilities vs development needs
• Scope and drive development activities for new requirements
• Support engineering reviews such as PDRs, CDRs and TRRs
• Provide technical support to internal/external customers including general questions and anomaly troubleshooting
• Maintain broad awareness of product development and production schedules to ensure the needs of customers and programs are satisfied

Please note: this position can be hired at the Senior Digital Payload Engineer I or Senior Digital Payload Engineer II level.

• Bachelor's degree in electrical engineering, computer science or other engineering discipline
• 5+ years of experience in space electronics with technical expertise in high‑speed serial interfaces (SPI, PCIe, Ethernet), system on chips, microcontrollers, and digital signal processing
• Experience in developing and delivering a digital product including assessing requirements, prototyping engineering models, and producing space‑worthy products
• Detailed knowledge of digital signal processing (DSP) algorithms and communication theory
• U.S. citizenship required due to program requirements

• Bachelor's degree in electrical engineering, computer science or other engineering discipline
• 8+ years of experience in space electronics with technical expertise in high‑speed serial interfaces (SPI, PCIe, Ethernet), system on chips, microcontrollers, and digital signal processing
• Experience in developing and delivering a digital product including assessing requirements, prototyping engineering models, and producing space‑worthy products
• Detailed knowledge of digital signal processing (DSP) algorithms and communication theory
• U.S. citizenship required due to program requirements

• Ability to obtain a TS/SCI clearance
• Deep experience in various modems and familiarity with latest modem components
• Extensive experience in space‑grade board design including parts selection and performance simulation for high‑speed digital and mixed‑signal circuits
• Extensive experience in circuit analyses including timing analysis and physical constraints
• Extensive experience supporting and leading complex engineering programs and developing associated documentation; demonstrated code design for re‑usability, maintainability, and scalability
• Experience designing, integrating, and testing communications systems for launch vehicles or satellites
• Experience leading incident management and investigations
• The ability to work under pressure and to tight deadlines
• Effective communication skills and the ability to build strong working relationships
• Project management experience

Positi…