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ECAD PCB Design Engineer

Job in Longmont, Boulder County, Colorado, 80502, USA
Listing for: Global Technical Talent, an Inc. 5000 Company
Full Time position
Listed on 2026-07-20
Job specializations:
  • Engineering
    Electronics Engineer
Salary/Wage Range or Industry Benchmark: 92 - 92.01 USD Hourly USD 92.00 92.01 HOUR
Job Description & How to Apply Below

Senior ECAD PCB Design Engineer

Location:

Longmont, CO

Onsite Flexibility:
Onsite

Position Type:
Contract
· Pay Rate: $92.00–$92.01 / Hour (USD)

Applicants must be authorized to work for any employer in the U.S. We are unable to sponsor or take over sponsorship of an employment Visa at this time.

Job Summary

We are seeking a highly skilled Senior ECAD PCB Design Engineer to lead the design and development of complex printed circuit board assemblies (PCBAs) supporting next-generation server and storage platforms, including high-density systems such as 2U24 Servers and 2U20 JBOD architectures. This role requires deep expertise in Mentor Graphics tools, high-speed digital design, PCB architecture, signal integrity, power distribution, and system-level integration.

The successful candidate will work closely with electrical, mechanical, thermal, firmware, manufacturing, and validation teams to deliver reliable, high-performance products that meet demanding performance, reliability, and compliance requirements. The engineer will serve as a technical leader throughout the product lifecycle—from concept and architecture through schematic development, PCB implementation, validation, compliance testing, and production release.

Key Responsibilities PCB Architecture & Design
  • Lead schematic capture, PCB architecture definition, component selection, and board-level design activities for server and storage products.
  • Design complex multilayer PCBAs supporting high-performance compute, storage, networking, and management functions.
  • Develop robust power distribution networks (PDN) and power sequencing solutions.
  • Ensure designs meet electrical, thermal, manufacturability, reliability, and cost objectives.
High-Speed Signal Design
  • Design and validate high-speed interfaces including:
    • PCI Express (Gen4/Gen5 and beyond)
    • SAS (12G/24G)
    • SATA
    • NVMe over PCIe
    • Ethernet interfaces (10G/25G/40G/100G/400G)
    • DDR4 and DDR5 memory interfaces
    • High-speed backplane and SERDES-based interconnects
  • Perform design reviews focused on:
    • Controlled impedance implementation
    • Differential pair routing
    • Length matching
    • Return path continuity
    • Crosstalk mitigation
    • Via optimization and stub reduction
    • Power integrity and noise management
Chassis-Level Integration
  • Collaborate with chassis, mechanical, and thermal teams to ensure successful integration within dense server and storage enclosures.
  • Evaluate board placement, connector strategies, airflow constraints, serviceability requirements, and manufacturability.
  • Support architecture decisions that balance performance, reliability, cost, and mechanical constraints.
Design Reviews & Technical Leadership
  • Lead cross-functional engineering reviews.
  • Develop and maintain PCB design guidelines, best practices, and reusable design methodologies.
  • Mentor junior engineers and provide technical oversight to outsourced layout resources when applicable.
  • Review external design deliverables to ensure adherence to product and company standards.
Manufacturing Support
  • Partner with manufacturing, supplier quality, and NPI teams to support prototype builds and production ramp activities.
  • Investigate and resolve manufacturing, assembly, and field reliability issues.
  • Support DFM, DFA, and DFT initiatives.
Required Skills High-Speed Design
  • PCIe Gen4/Gen5
  • SAS 12G/24G
  • SATA
  • NVMe
  • Ethernet 10G–400G
  • SERDES architectures
  • DDR4/DDR5
PCB Design
  • Mentor Graphics proficiency
  • Multilayer PCB design (up to 24 layers)
  • Controlled impedance routing
  • Differential pair design
  • Power distribution network design
  • Design for Manufacturability (DFM)
  • Design for Assembly (DFA)
  • Design for Test (DFT)
  • Strong expertise in high-speed digital design
  • Strong expertise in signal integrity fundamentals
  • Strong expertise in power integrity fundamentals
  • Strong expertise in PCB stack‑up development
  • Strong expertise in EMI/EMC mitigation
  • Knowledge of DDR4/DDR5, PCIe, SAS, SATA, SERDES, and Ethernet technologies
  • Experience interpreting vendor reference designs, compliance requirements, and chipset design guides
  • Strong understanding of PCB fabrication and assembly processes
  • Experience with modern ECAD design platforms such as Siemens Xpedition, Cadence Allegro, Altium Designer, or equivalent enterprise-level ECAD tools
Preferred…
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