Senior Internal Harnessing and Packaging Engineer – BNS Core Components

• Serve as a technical leader responsible for the design, integration, and production readiness of all internal harnessing and packaging within the Tera Wave flight product.
• Apply expertise to mature designs, ensuring they are robust for the space environment and optimized for efficient, large-scale, automated manufacturing.
• Proactively embed DFM/DFA principles into all design cycles for internal harnesses, enclosures, PCB/PCBA’s, and electronic assemblies.
• Own and lead the technical effort to transition complex product-internal harnessing and packaging designs from low-rate initial builds to a high-rate production environment.
• Collaborate with manufacturing engineers and suppliers to develop and validate production processes, tooling, and test procedures to achieve required production rates and quality.
• Design and release detailed 3D models and 2D drawings for internal wire harnesses, cable assemblies, and electronics enclosures using Altium, Creo, Solid Works, and Windchill.
• Oversee and contribute to structural, thermal, and vibration analysis of electronic packaging and develop verification and validation test campaigns (qualification, acceptance, etc.).
• Mentor junior engineers, sharing best practices in design for manufacturing, product internal harness design, and product maturation.

• B.S. degree in Mechanical, Electrical, Aerospace Engineering, or a related technical field.
• 8+ years of experience in the design and delivery of electronics packaging and/or harnessing for complex systems as an integrated part of a final product.
• Demonstrated, hands-on experience leading the transition of a product from a prototype/development phase into a high-rate production environment.
• Proven expertise in Design for Manufacturing (DFM), Design for Assembly (DFA), and cost reduction methodologies.
• Strong proficiency with 3D CAD software (Creo/Solid Works preferred) for harnessing and mechanical design.
• Deep understanding of harness manufacturing processes, standards (e.g., IPC/WHMA-A-620), and quality control.
• Experience working through the full engineering lifecycle, including requirements definition, design, analysis, manufacturing, and testing.
• Must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Demonstrates expertise in the design and production readiness of electronics packaging and harnessing, with a strong focus on Design for Manufacturing (DFM) and Design for Assembly (DFA) principles. Proven ability to lead complex product transitions from prototype to high-rate production while ensuring quality and efficiency.

• Design For Manufacturing (DFM)
• Design For Assembly (DFA)
• 3D CAD Software (Creo/Solid Works)
• Electronics Packaging Design
• Harness Manufacturing Processes

• Electronics Packaging Design
• Harness Design
• 3D CAD Software (Creo)
• 3D CAD Software (Solid Works)
• DFM Principles
• DFA Principles
• Vibration Analysis
• Thermal Analysis
• Verification and Validation Testing
• Cost Reduction Methodologies

• Mentoring
• Collaboration
• Leadership

• IPC/WHMA-A-620
• Engineering Lifecycle
• Production Processes
• Quality Control
• High-Rate Production

• Altium
• Windchill