Space Hardware Structural​/Thermal Analyst; R&D Engineer

Position: Space Hardware Structural/Thermal Analyst (R&D Engineer 2/3)
** What You Will Do*
* Los Alamos National Laboratory is seeking a structural and thermal analyst to join the Space Instrument Realization Group (ISR-5). In this role, you will perform structural and/or thermal analyses for space hardware at the component, assembly, and integrated-system levels. Your work will help ensure instruments and payloads pass environmental testing, survive launch, and operate successfully in space.

ISR-5 develops and deploys advanced measurement systems from concept through mission execution. You will work closely with mechanical designers, electrical engineers, scientists, technicians, analysts, and test personnel to develop robust, flight-ready systems for national security and scientific missions.

This position offers the opportunity to work on mission-driven space hardware from early concept development through design, analysis, environmental test, and deployment. Your analysis will shape hardware decisions, test plans, risk assessments, design reviews, and mission readiness for real systems built for demanding environments. You will contribute to nationally important and scientifically significant programs while growing your technical depth alongside experienced engineers, scientists, and technicians in a highly collaborative environment.

The ideal candidate will differentiate themselves with enthusiasm, curiosity, and a passion for effective teaming.

The Intelligence and Space Research Division at LANL has more than 60 years of experience designing, building, and operating ground-, air-, and space-based systems supporting nuclear nonproliferation, treaty verification, remote sensing, space situational awareness, and NASA missions including Curiosity, Perseverance, IBEX, Van Allen Probes, and IMAP.

This position will be filled at either the R&D Engineer 2 or R&D Engineer 3 level, depending on the skills of the selected candidate.  Additional job responsibilities (outlined below) will be assigned if the candidate is hired at the higher level.

** R&D Engineer 2 ($106,400-$176,000)*
* At the R&D Engineer 2 level, you will support structural and thermal analysis activities for spaceflight and flight-like hardware.

Responsibilities include:

+ Perform static, dynamic, and thermal analyses using finite element analysis, hand calculations, and other analytical methods.

+ Develop structural and thermal models, define assumptions and boundary conditions, perform calculations, and assess margins.

+ Support design trades, risk reduction activities, and engineering decisions throughout hardware development.

+ Support environmental testing, including vibration, shock, thermal cycling, and thermal vacuum testing.

+ Compare analytical predictions with test data and support model correlation.

+ Prepare clear technical reports, presentations, and review materials for internal and external stakeholders.

+ Contribute to ISR-5 structural and thermal analysis tools, methods, and best practices.

** R&D Engineer 3 ($128,000-$215,900)*
* In addition to the responsibilities listed above, the R&D Engineer 3 will provide technical leadership for structural and thermal analysis of space hardware.

Additional responsibilities include:

+ Lead structural and/or thermal analysis efforts for complex space hardware, payloads, or integrated systems.

+ Define analysis approaches, model verification strategies, and test-correlation plans.

+ Translate program requirements, launch environments, and mission constraints into actionable analysis criteria.

+ Provide technical recommendations that support design reviews, test readiness reviews, qualification reviews, and flight-readiness decisions.

+ Mentor early-career staff in modeling practices, documentation quality, peer review, and engineering judgment.

+ Interface with customers, sponsors, and project stakeholders to define scope, communicate results, and plan deliverables.

** What You Need*
* ** Minimum

Job Requirements:

*
* + Knowledge of finite element analysis, stress analysis, structural dynamics, thermal analysis, and engineering fundamentals.

+ Proficient in simulation tools, such as ANSYS, Abaqus, Thermal Desktop, Simcenter, NASTRAN.

+ Experience working with CAD geometry and engineering drawings.

+ Knowledge of mechanical and thermal environments relevant to flight hardware, such as launch loads, vibration, shock, thermal cycling, thermal vacuum, or operational thermal environments.

+ Experience selecting and placing transducer hardware for relevant data collection and enhanced comprehension of flight hardware performance.

+ Ability to work effectively in a multidisciplinary team environment, including interfacing with other engineers, scientists, technicians, project/program staff, and other stakeholders.

+ Excellent written and verbal communication skills, including the ability to document analysis assumptions, methods, results, margins, risks, and recommendations.

+ Demonstrated commitment to safety, security, quality, peer review, and responsible engineering practices.

+ Ability to…