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Senior IC Package Design Engineer Speed SiP & RF

Job in Los Angeles, Los Angeles County, California, 90079, USA
Listing for: Apple Inc.
Full Time position
Listed on 2026-02-15
Job specializations:
  • Engineering
    Systems Engineer, Electrical Engineering, Electronics Engineer, Engineering Design & Technologists
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below
Position: Senior IC Package Design Engineer – High-Speed SiP & RF
A leading technology firm in California is seeking an experienced IC Package Design Engineer to manage and optimize packaging solutions for innovative consumer electronics. The role involves physical design of various chips, interfacing with diverse teams, and will require deep knowledge in electrical, thermal, and mechanical engineering principles. Candidates should possess over 10 years of relevant experience and proficiency in tools like Cadence Allegro.

A commitment to detail and collaboration in a high-paced environment is essential.
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Position Requirements
10+ Years work experience
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