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Digital PCB Layout Engineer III - TeraWave

Job in Los Angeles, Los Angeles County, California, 90079, USA
Listing for: Blue Origin LLC
Full Time position
Listed on 2026-02-23
Job specializations:
  • Engineering
    Electronics Engineer, Electrical Engineering, Systems Engineer, Hardware Engineer
Salary/Wage Range or Industry Benchmark: 130706 - 182987 USD Yearly USD 130706.00 182987.00 YEAR
Job Description & How to Apply Below
Digital PCB Layout Engineer III - Tera Wave page is loaded## Digital PCB Layout Engineer III - Tera Wave locations:
Los Angeles, CA:
Bay Area, CAtime type:
Full time posted on:
Posted Todayjob requisition :
R60800

Application close date:

Applications will be accepted on an ongoing basis until the requisition is closed.

At Blue Origin, we envision millions of people living and working in space for the benefit of Earth. We’re working to develop reusable, safe, and low-cost space vehicles and systems within a culture of safety, collaboration, and inclusion. Join our team of problem solvers as we add new chapters to the history of spaceflight! This role is part of Tera Wave, a satellite communications network designed to deliver symmetrical data speeds of up to 6 Tbps anywhere on Earth.

This network will service tens of thousands of enterprise, data center, and government users who require reliable connectivity for critical operations.

As a
** PCB Design Engineer III
** at Blue Origin, you will be responsible for designing high-performance printed circuit boards for our advanced communication systems, including beamforming ASICs, high-speed digital front-ends, and RF/microwave interfaces. Your designs will be the physical foundation that brings our digital communication systems to life, operating reliably in the extreme environment of space.

This role requires expertise in both high-speed digital design and RF/microwave PCB layout. You will work closely with digital designers, RF engineers, and mechanical engineers to create boards that meet stringent signal integrity, EMI/EMC, thermal, and space-qualification requirements. This is an opportunity to work on cutting-edge hardware that will enable the future of space communications.
** Responsibilities include but are not limited to:
*** Design multi-layer PCBs for complex digital and mixed-signal systems including FPGAs, ASICs, high-speed ADCs/DACs, and power management
* Develop PCB layouts for RF/microwave circuits with careful attention to impedance control, loss tangent, and electromagnetic compatibility
* Perform signal integrity analysis for high-speed digital interfaces (PCIe, JESD
204B/C, DDR, Ethernet)
* Conduct power integrity analysis and design power distribution networks (PDN) for low-noise, high-current applications
* Create component libraries, design rule checks (DRCs), and maintain design standards
* Collaborate with electrical engineers on component selection, schematic review, and design optimization
* Generate fabrication and assembly documentation including Gerber files, drill files, and assembly drawings
* Work with PCB fabricators and CM vendors to ensure manufacturability and resolve fabrication issues
* Support board bring-up activities, debugging hardware issues related to PCB design
* Design for space environment considerations including thermal management, radiation tolerance, and mechanical stress
*
* Minimum Qualifications:

*** B.S. in Electrical Engineering, Computer Engineering, or related field with 5+ years of PCB design experience
* Proficiency with PCB design tools (Altium Designer, Cadence Allegro, or similar)
* Strong understanding of signal integrity principles for high-speed digital design (transmission lines, termination, crosstalk)
* Experience with controlled impedance design and working with PCB stackup optimization
* Knowledge of EMI/EMC best practices and design guidelines
* Familiarity with IPC standards (IPC-2221, IPC-6012, IPC-A-610)
* Experience with PCB layout for FPGAs, high-speed ADCs/DACs, or mixed-signal designs
*
* Preferred Qualifications:

*** Experience with RF/microwave PCB design using high-frequency laminates (Rogers, Taconic, etc.)
* Knowledge of power integrity analysis tools (e.g., Ansys SIwave, Cadence Sigrity)
* Familiarity with thermal analysis tools and thermal management techniques for high-power electronics
* Experience designing for space environment (vacuum, thermal cycling, radiation, vibration)
* Understanding of design for manufacturing (DFM) and design for test (DFT) principles
* Knowledge of conformal coating, potting, and other space-qualification techniques
* Previous experience with aerospace or satellite…
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