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Principal ASIC Package Design Engineer; FC-BGA/MCM
Job in
Los Angeles, Los Angeles County, California, 90079, USA
Listed on 2026-07-10
Listing for:
K2 Space
Full Time
position Listed on 2026-07-10
Job specializations:
-
Engineering
Hardware Engineer -
Design & Architecture
Job Description & How to Apply Below
K2 Space is seeking a Principal ASIC Package Design Engineer to lead advanced FC‑BGA and MCM packaging strategies for high‑performance mixed‑signal and digital SoCs. You will own the end‑to‑end package architecture, engage with vendors, and drive roadmaps from architecture through production ramp.
You will act as the technical authority for package design, influencing silicon and system architecture while ensuring first‑pass success for complex, high‑speed, power‑dense ASICs.
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