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Principal ASIC Package Design Engineer; FC-BGA​/MCM

Job in Los Angeles, Los Angeles County, California, 90079, USA
Listing for: K2 Space
Full Time position
Listed on 2026-07-10
Job specializations:
  • Engineering
    Hardware Engineer
  • Design & Architecture
Salary/Wage Range or Industry Benchmark: 200000 - 280000 USD Yearly USD 200000.00 280000.00 YEAR
Job Description & How to Apply Below
Position: Principal ASIC Package Design Engineer (FC-BGA/MCM)

K2 Space is seeking a Principal ASIC Package Design Engineer to lead advanced FC‑BGA and MCM packaging strategies for high‑performance mixed‑signal and digital SoCs. You will own the end‑to‑end package architecture, engage with vendors, and drive roadmaps from architecture through production ramp.

You will act as the technical authority for package design, influencing silicon and system architecture while ensuring first‑pass success for complex, high‑speed, power‑dense ASICs.

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