Principal​/Sr. Principal PCB Layout Design Engineer

RELOCATION ASSISTANCE:
Relocation assistance may be available

CLEARANCE REQUIRED FOR START:
No

CLEARANCE TYPE:
Top Secret

TRAVEL:
Yes, 10% of the Time

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon.

We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Mission Systems is a trusted provider of mission‑enabling solutions for global security. Our Engineering and Sciences (E&S) organization pushes the boundaries of innovation, redefines engineering capabilities, and drives advances in various sciences. Our team is chartered with providing the skills and innovative technologies to develop, design, produce, and sustain optimized product lines across the sector while providing a decisive advantage to the warfighter.

Come be a part of our mission!

We are looking for you to join our team as a Principal / Sr. Principal PCB Layout Design Engineer based out of Woodland Hills, CA. As a Principal / Sr. Principal PCB Layout Design Engineer at Northrop Grumman, you will have a challenging and rewarding opportunity to support the design and delivery of high‑reliability circuit card assemblies for aerospace, defense, and space flight applications.

You will collaborate across electrical, mechanical, manufacturing, and signal integrity disciplines to transform complex electrical architectures and schematics into robust, production‑ready printed circuit board solutions. The successful candidate will be collaborative, open, and team‑oriented, with a focus on shared responsibility, continuous learning, and a culture of innovation and technical excellence.

For this role, responsibilities include but are not limited to:

• Execute the placement and routing of complex, high‑density, multi‑layer printed circuit boards (PCBs), including high‑speed digital, RF, mixed‑signal, and power circuits
• Interpret electrical schematics, constraints, and mechanical boundaries to develop optimized PCB layouts that meet performance, reliability, and manufacturability requirements
• Generate and maintain complete PCB and circuit card assembly (CCA) fabrication and assembly documentation packages, including artwork, drawings, fabrication notes, and data outputs for procurement and assembly partners
• Apply current IPC and high‑reliability industry standards, as well as applicable military and aerospace criteria, in the design and verification of printed wiring boards and circuit card assemblies
• Collaborate closely with electrical, mechanical, manufacturing, and signal integrity engineers to address layout‑related design challenges involving signal integrity, power integrity, thermal management, and packaging
• Support and perform Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Test (DFT) reviews using automated and manual checks to improve yield, test coverage, and product robustness
• Work with fabrication and assembly suppliers to understand manufacturing capabilities and constraints and incorporate them into PCB designs
• Support PCB library management practices, ensuring correct use of symbols, footprints, and…