Principal Engineer-Process; Wafer Fab

Principal Process Engineer

We are looking for a Principal Process Engineer who enjoys working within a team environment. In this role, you will support wafer fab tools and processes in one or more functional areas (Photo, Etch, Deposition, Diffusion, etc.) in a fab that makes PIN, Zener, and Schottky diodes on silicon and gallium arsenide wafers with emphasis on the Commercial & Military Communication/RADAR & Instrumentation market.

• Act as a subject‑matter expert in semiconductor wafer processing and provide cross‑functional support.
• Have detailed understanding of selected process modules (Photo, Etch, Deposition, Diffusion, etc.).
• Create and update process specifications.
• Study and improve equipment performance for improved reliability and repeatability.
• Study and improve process performance for improved control and repeatability.
• Lead teams to improve yields, reduce cycle time or reduce cost.
• Use Statistical Process Control for process monitoring of critical parameters.
• Qualify new equipment for process use.
• Analyze and present data to technical audiences.
• Perform other design, development, and support tasks as assigned.

• Bachelor’s degree in Chemical Engineering, Electrical Engineering, or other related engineering discipline.
• 10+ years of experience in semiconductor manufacturing.
• Ability to think out‑of‑the‑box and create unique solutions to problems.
• Knowledge and experience with silicon wafer fabrication process.
• Knowledge of Statistical Process Control (SPC) and Design of Experiments (DoE).
• Familiarity with Six Sigma principles and methods.
• Proficiency in problem solving using 8‑D reports or other methodologies.
• Advanced Microsoft Excel skills for data analysis.
• Strong analytical skills with proficiency in data analysis tools such as Microsoft Excel and JMP.
• Basic knowledge of Microsoft Word and PowerPoint.
• Effective verbal and written communication skills (English).

• Experience in legacy wafer fabs working with technologies on 3"–6" wafers.
• Experience in photo or etch.
• Skills in using AI for research, data analysis, and presentation of data.

U.S. Export Controls Requirements:
This job requires access to technology, materials, software or hardware that is controlled by U.S. export laws. Candidates must provide proof of U.S. citizenship, permanent U.S. residency, or classification as a protected individual.

Travel: 0%–25%.

Physical Requirements:

Able to lift up to 25 lbs, carry 15 lbs; sit 10% of the time, stand 60%, walk 40%; perform activities that include stooping, reaching, handling, hearing, talking, seeing; works alone and with others.