Process Engineer, Principal

Process Engineer

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks.

MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers' success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.

Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure!

In this critical role, you will be responsible for supporting backend wafer fabrication processes, including grinding, polishing, glassing, wafer bonding, mounting/dismounting, and other operations within MACOM's internal wafer fabrication facility. You will also provide support across additional manufacturing areas as needed and serve as backup coverage for other operations within the upstairs fab. This position encompasses both the development of new manufacturing processes and the sustainment and continuous improvement of existing processes.

The product portfolio supported by this role includes technologies based on GaN, GaAs, Si, and InP materials.

Main Duties and Responsibilities

• Develop, continuously improve, and sustain processes in close partnership with Device and Integration Engineering and Business Unit design teams.
• Serve in a hands-on capacity requiring a broad understanding of wafer fabrication equipment and processes. Responsibilities include setup, qualification, optimization, and troubleshooting of automated equipment used for Wafer Grinding, Edge Grinding, Chemical-Mechanical Planarization (CMP), Polishing, Wafer Bonding, Mount/Demount processes, glassing.
• Sustain wafer fabrication processes to meet all factory indicators; plan and execute experiments to fully characterize processes throughout the development cycle; drive improvements in quality, reliability, cost, yield, process stability/capability, productivity, and safety/ergonomics across variables such as material, method, equipment, environment, and operating personnel.
• Provide daily process support, including equipment setup, writing new programs, adjusting/optimizing parameters, running engineering lots, troubleshooting equipment, and supporting production in identifying, responding to, and dispositioning non-conforming material.
• Take ownership of entire processes, including equipment selection, process and equipment qualification, writing detailed setup instructions and procedures, and training operators, technicians, and other engineers on equipment operation. Update and create routing documentation as needed.
• Apply general knowledge of electronics manufacturing and maintain strong technical understanding of wafer fabrication processes.

Key Competencies Required

• Excellent judgment, familiarity with semiconductor processing, and an optimistic, proactive approach.
• Ability to develop solutions using formal education, statistical methods, and structured problem-solving tools.
• Proven track record of solving technical problems, owning projects, meeting deadlines, and managing multiple tasks.
• Strong sense of ownership, enthusiasm, and dedication to process improvement.
• Ability to work collaboratively with cross-functional teams to enhance processes.
• Excellent verbal and written communication skills, including technical writing for data summaries, findings, process specifications, equipment…