Dry Etch Process Engineer

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense.  We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies.  Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks.

MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers’ success.  We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.

Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure!
** Dry Etch Process Engineer
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* Job Description:

** In this critical role you will be responsible for the Dry Etch processes within MACOM’s internal semiconductor fab. The product portfolio includes GaN, GaAs, Si, and InP based technologies. Responsibilities include development, continuous improvement, and sustaining processes all in close partnership with Device and Integration Engineering as well as Business Unit design teams. Excellent judgment, a strong knowledge of semiconductor processing, and an optimistic, can-do approach are essential to success in this role.

The position reports to the Engineering Manager.
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* Job Qualifications:

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* • BS or MS degree in Engineering or Physics with at least 5 years of fab experience.
• Demonstrated knowledge in semiconductor processes, especially in Dry Plasma Etch and or Descum Process.
• Familiarity with typical materials systems for Silicon and/or compound semiconductor.
• Strong understanding of semiconductor device physics and IC processing, data mining and statistics, SPC, DOE, Lean manufacturing, Six Sigma, and structured problem solving.
• Must have a proven track record of solving technical problems, project ownership, meeting deadlines, and multitasking.
• Must display a strong sense of ownership, drive and dedication to continuous improvement.
• Must display an enthusiastic boldness for taking on aggressive goals and a commitment to achieving them.
• Must possess the ability to work collaboratively with cross functional teams to improve processes.
• Excellent verbal/written communication skills, including technical writing for summarizing data and findings, writing process and equipment specifications and work instructions.
• Detail-oriented with strong organizational skills.
** EEO:
** MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis of race, color, religion, sex, gender identity, sexual orientation, national origin, age, disability, genetic information, veteran status, military service, marital status, or any other category protected under applicable law.
** Reasonable Accommodation:
** MACOM is committed to working with and providing reasonable accommodations to qualified individuals with physical and mental disabilities. If you have a disability and are in need of a reasonable accommodation with respect to any part of the application process, please call  or email HR  Provide your name, phone number and the…