Technician IV - Engineering

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip's nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values;

we affectionately refer to it as the Aggregate System and it's won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.

Visit our careers page to see what exciting opportunities and company perks await!

Job Description:

The Technician IV - Engineering plays a critical hands-on role in supporting semiconductor device assembly, process development, and new product introduction (NPI). This position works closely with engineering and operations teams to execute, sustain, and improve manufacturing processes for semiconductor and MMIC chip-and-wire assemblies.

This role is highly hands-on, with primary responsibility for supporting die attach and wire bonding processes, prototype builds, and production activities. The technician contributes to process optimization, troubleshooting, and continuous improvement initiatives to ensure high-quality, reliable, and efficient manufacturing operations.

* Serve as a key technical liaison between Engineering and Operations to support execution and sustainment of assembly processes for assigned product lines

* Set up, operate, and maintain equipment used in die attach, wire bonding, and related semiconductor assembly processes

* Perform hands-on troubleshooting of process and equipment issues; escalate and assist in root cause investigations as needed

* Collect and analyze production data to support yield improvement, process stability, and continuous improvement efforts

* Ensure adherence to applicable industry and military standards, including MIL-PRF-19500, MIL-PRF-38534, and IPC-600

* Develop and maintain work instructions, process documentation, and training materials to ensure consistency in manufacturing operations

* Train and mentor junior technicians and operators on equipment, processes, and best practices

* Support routine production activities, including inspections, rework, and process verification

Requirements/

Qualifications:

* Minimum of 5-7 years of experience in a semiconductor or electronics manufacturing environment

* Strong hands-on experience with die attach and wire bonding equipment and processes

* Ability to read and follow detailed work instructions, process flows, and technical drawings

* Proficiency with Microsoft Office tools, especially Excel for data tracking and reporting

* Strong troubleshooting skills with attention to detail in a cleanroom or controlled manufacturing environment

* Effective communication skills and ability to work cross-functionally in a fast-paced environment

* Demonstrated ability to work independently with minimal supervision while managing priorities and maintaining high-quality standards in a fast-paced manufacturing environment

Preferred Requirements/

Qualifications:

* Experience with chip-and-wire assembly and MMIC device handling

* Hands-on experience with materials such as Au/Sn, Au/Ge, SAC
305, conductive epoxies, and silver sintering

* Familiarity with gold wire bonding, encapsulation, and inspection processes

* Experience working to MIL-PRF-19500 and/or MIL-PRF-38534 standards

* Knowledge of IPC-600 requirements and PCB assembly processes

* Prior experience training or mentoring technicians in a production environment

Travel Time:

0% - 25%

Physical Attributes:

Carrying, Crouching, Feeling, Foot Controls, Handling, Hearing, Kneeling, Lifting, Noise and/or vibration, Other, Pulling, Pushing, Reaching, Seeing, Talking, Works Alone, Works Around Others

Physical Requirements:

Able to lift, push, pull, 25lbs, carry 15lbs, sit 10%, stand 60% walk 40 %, must be able to perform activities that include stooping, reaching, handling, hearing, talking, seeing, works alone, works around others

Pay Range:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive base pay, restricted stock units,…