Electroplating Chemist
Listed on 2026-08-22
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Engineering
Process Engineer, Materials Engineering, Research Scientist, Electronics Engineer -
Research/Development
Research Scientist, Electronics Engineer
Electroplating Chemist
The Electroplating Chemist is responsible for the development, optimization, scale-up, and commercialization of advanced electroplating processes and surface treatment of electrode posited copper foil technologies for high-performance PCB, battery, and advanced electronics applications. This role combines hands-on laboratory work with pilot-scale and manufacturing support to develop new products, improve process capability, and solve complex technical challenges. The position serves as a key technical resource for innovation, product development, and continuous improvement initiatives.
Key ResponsibilitiesResearch & Product Development
· Design and execute laboratory experiments to develop new electroplating bath chemistries, additives, and surface treatment technologies for electrode posited copper foil manufacturing.
· Develop next-generation plating processes to improve electrical, mechanical, thermal, and surface performance characteristics.
· Investigate new materials, additives, and process technologies to support strategic growth initiatives.
· Lead new product development projects from concept through commercial implementation.
· Develop technical data packages and qualification plans for customer approvals.
Process Development & Scale-Up
· Translate laboratory findings into pilot-scale and production-scale processes.
· Design experiments (DOE) to optimize plating performance and establish process windows.
· Evaluate relationships between plating chemistry, operating conditions, deposit structure, and product performance.
· Support technology transfer from R&D to manufacturing operations.
· Establish process control methodologies and operating specifications for new products.
Technical Problem Solving
· Lead root-cause investigations involving plating defects, contamination events, and process instability.
· Utilize analytical techniques to characterize deposits, surface morphology, and chemical composition.
· Develop corrective actions and long-term solutions for complex technical issues.
· Support customer-facing technical discussions and failure analysis investigations.
Laboratory & Analytical Activities
· Perform chemical analysis and characterization of plating baths and deposits.
· Utilize laboratory equipment to evaluate electrochemical performance, deposit properties, and material characteristics.
· Maintain laboratory documentation, technical reports, and experimental databases.
· Develop new analytical methods to support process development and quality improvement.
Customer & Market Development
· Collaborate with sales and marketing teams to understand emerging technical requirements and market trends.
· Generate technical presentations and reports for customers, management, and industry partners.
· Participate in technical conferences, industry working groups, and collaborative development programs.
Intellectual Property & Innovation
· Identify opportunities for patentable technologies and process innovations.
· Maintain awareness of industry developments, competitive technologies, and emerging market opportunities.
· Contribute to the company's intellectual property strategy and technology roadmap.
Required Qualifications· Bachelor's degree in Chemistry, Chemical Engineering, Materials Science, Electrochemistry, Metallurgy, or related technical field.
· Minimum 5 years of hands-on electroplating, electrochemical process development, or surface finishing experience.
· Strong understanding of electrochemistry, electrode position mechanisms, and plating process fundamentals.
· Experience designing and executing structured experimental programs.
· Proven ability to analyze technical data and draw actionable conclusions.
· Strong technical writing and presentation skills.
Preferred Qualifications· Advanced degree (M.S. or Ph.D.) in Chemistry, Electrochemistry, Materials Science, or related field.
· Experience developing copper, nickel, tin, silver, gold, or specialty alloy plating systems.
· Experience in electrode posited copper foil, printed circuit boards, semiconductor, battery materials, or advanced electronics manufacturing.
· Knowledge of adhesion promoters, surface treatments, and…
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