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Electroplating Chemist

Job in Lugoff, Kershaw County, South Carolina, 29078, USA
Listing for: Camden Copper/Metis Endeavor
Full Time position
Listed on 2026-08-22
Job specializations:
  • Engineering
    Process Engineer, Materials Engineering, Research Scientist, Electronics Engineer
  • Research/Development
    Research Scientist, Electronics Engineer
Job Description & How to Apply Below

Electroplating Chemist

The Electroplating Chemist is responsible for the development, optimization, scale-up, and commercialization of advanced electroplating processes and surface treatment of electrode posited copper foil technologies for high-performance PCB, battery, and advanced electronics applications. This role combines hands-on laboratory work with pilot-scale and manufacturing support to develop new products, improve process capability, and solve complex technical challenges. The position serves as a key technical resource for innovation, product development, and continuous improvement initiatives.

Key Responsibilities

Research & Product Development

· Design and execute laboratory experiments to develop new electroplating bath chemistries, additives, and surface treatment technologies for electrode posited copper foil manufacturing.

· Develop next-generation plating processes to improve electrical, mechanical, thermal, and surface performance characteristics.

· Investigate new materials, additives, and process technologies to support strategic growth initiatives.

· Lead new product development projects from concept through commercial implementation.

· Develop technical data packages and qualification plans for customer approvals.

Process Development & Scale-Up

· Translate laboratory findings into pilot-scale and production-scale processes.

· Design experiments (DOE) to optimize plating performance and establish process windows.

· Evaluate relationships between plating chemistry, operating conditions, deposit structure, and product performance.

· Support technology transfer from R&D to manufacturing operations.

· Establish process control methodologies and operating specifications for new products.

Technical Problem Solving

· Lead root-cause investigations involving plating defects, contamination events, and process instability.

· Utilize analytical techniques to characterize deposits, surface morphology, and chemical composition.

· Develop corrective actions and long-term solutions for complex technical issues.

· Support customer-facing technical discussions and failure analysis investigations.

Laboratory & Analytical Activities

· Perform chemical analysis and characterization of plating baths and deposits.

· Utilize laboratory equipment to evaluate electrochemical performance, deposit properties, and material characteristics.

· Maintain laboratory documentation, technical reports, and experimental databases.

· Develop new analytical methods to support process development and quality improvement.

Customer & Market Development

· Collaborate with sales and marketing teams to understand emerging technical requirements and market trends.

· Generate technical presentations and reports for customers, management, and industry partners.

· Participate in technical conferences, industry working groups, and collaborative development programs.

Intellectual Property & Innovation

· Identify opportunities for patentable technologies and process innovations.

· Maintain awareness of industry developments, competitive technologies, and emerging market opportunities.

· Contribute to the company's intellectual property strategy and technology roadmap.

Required Qualifications

· Bachelor's degree in Chemistry, Chemical Engineering, Materials Science, Electrochemistry, Metallurgy, or related technical field.

· Minimum 5 years of hands-on electroplating, electrochemical process development, or surface finishing experience.

· Strong understanding of electrochemistry, electrode position mechanisms, and plating process fundamentals.

· Experience designing and executing structured experimental programs.

· Proven ability to analyze technical data and draw actionable conclusions.

· Strong technical writing and presentation skills.

Preferred Qualifications

· Advanced degree (M.S. or Ph.D.) in Chemistry, Electrochemistry, Materials Science, or related field.

· Experience developing copper, nickel, tin, silver, gold, or specialty alloy plating systems.

· Experience in electrode posited copper foil, printed circuit boards, semiconductor, battery materials, or advanced electronics manufacturing.

· Knowledge of adhesion promoters, surface treatments, and…

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