Hardware Engineering Technical Leader
Job in
Lynn, Essex County, Massachusetts, 01910, USA
Listed on 2026-08-16
Listing for:
Jobtailor
Full Time
position Listed on 2026-08-16
Job specializations:
-
Manufacturing / Production
Manufacturing Engineer, Packaging Engineer, Quality Engineering -
Engineering
Manufacturing Engineer, Packaging Engineer, Process Engineer, Quality Engineering
Job Description & How to Apply Below
- Lead technical ownership of optical transceiver assembly process development
- Develop high-volume, highly automated, and cost-effective manufacturing processes
- Drive the development and optimization of 2D/2.5D/3D wafer-level packaging processes
- Design and implement Design of Experiments (DOE) to optimize process capability
- Serve as the in-house technical expert for wafer-level packaging and mechanical assembly automation equipment
- Partner cross-functionally with design, test, reliability, and manufacturing teams to improve product manufacturability
- Bachelor's degree in Physics, Mechanical Engineering, Materials Science, or a related field with 12+ years of experience, or Masters + 8 years of related experience, or PhD + 5 years of related experience
- 8+ years of experience in back-end wafer processing
- expertise in materials characterization, failure analysis, IC packaging materials, and semiconductor packaging manufacturing processes
- experience managing overseas contract manufacturers
- leading cross-functional teams to resolve manufacturing issues
- delivering consistent results in high-volume production environments
Demonstrates expertise in optical transceiver assembly process development, wafer-level packaging, and mechanical assembly automation. Proven ability to lead cross-functional teams and optimize manufacturing processes in high-volume production environments.
Highest-signal resume keywords- Optical Transceiver Assembly Process Development
- Wafer-Level Packaging
- Design Of Experiments (DOE)
- Materials Characterization
- High-Volume Production
- Back-End Wafer Processing
- Failure Analysis
- IC Packaging Materials
- Semiconductor Packaging Manufacturing
- Process Optimization
- Cross-Functional Team Leadership
- Problem Solving
- Manufacturing Processes
- Contract Manufacturing
- Product Manufacturability
- Mechanical Assembly Automation Equipment
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