MEMS Process Integration Engineer

HRL Laboratories pioneers the next frontiers of physical and information science. Delivering transformative technologies in automotive, aerospace and defense, HRL advances the critical missions of its customers to help them remove limitations and create competitive advantage. HRL then transitions the work back to customers – ready for real-world application. For more than 70 years, HRL’s rich portfolio of scientific discoveries and engineering innovations continues to build on each other — often in unexpected, profound and far-reaching ways.

As a private company owned jointly by Boeing and GM, HRL prioritizes purpose over profit, significantly advancing the state of the art.

HRL Laboratories advances critical structural and functional materials and semiconductor devices that enable precision navigation, quantum technologies and extreme-environment performance. With expertise from design through deployment, we deliver scalable, high-performance solutions that transform our customers’ missions. Our work leverages digital manufacturing and scalable microfabrication techniques to meet tomorrow’s toughest challenges.

You will be joining a diverse team of applied scientists and engineers in the development of next generation MEMS-enabled sensors and actuators for high-performance aerospace, automotive and industrial applications.

• Innovate and create novel microfabrication processes and integrate them into fully optimized process flows that will be applied to our cutting-edge wafer-scale sensors and actuators’ R&D efforts
• Participate in the design, layout, fabrication, and characterization of MEMS-enabled devices and subsystems
• Conduct layout design and designs of experiments
• Through in-process wafer inspections and metrology data, provide timely feedback to project teammates
• Expected to be a task lead who will eventually provide project leadership

• Ph.D. or Master’s Degree in a physical science or engineering field with 5+ years of fabrication process experience in an R&D environment
• Strong track record of process development, process optimization, design of experiments methodology, statistical data analysis and problem solving
• Solid verbal and written communication skills in a multi-person team environment, and enable cross-laboratory collaboration and coordination
• Ability to combine disparate process recipes into a full fabrication flow and understand the impact of process interdependence
• Possesses experience and process development expertise in contact/stepper photolithography, wet and plasma dry etches, high aspect-ratio deep reactive ion etching (DRIE) of silicon, glass and other MEMS relevant materials, chemical vapor deposition, dielectric and metal depositions, wafer bonding and vacuum encapsulation of microscale structures, sacrificial and structural layer creation and wet/dry release
• Ability to conduct metrology such as optical/infrared microscope inspections, interferometric measurements and scanning electron microscopy with elemental analysis is required. Design and characterize process control monitors (PCM) for in-process verification
• Ability to design, modify and/or review mask layouts in CAD layout software such as L-Edit or Cadence

• Hands-on experience with both surface and bulk micro-machining is highly desired
• Proper documentation of fabrication experiments is desired
• Back-end wafer process experience in wafer grinding, CMP, die singulation and assembly processes into packages is a plus
• Ability to utilize data analysis software such as JMP, MATLAB, or python is a major plus
• Automation of fabrication data collection and analysis is a plus
• Device simulation such as mechanical, thermal, or electrical Finite element analysis (FEA) modeling in COMSOL or Solid Works is desired

• Must be able to perform safely in a MEMS microfabrication cleanroom and follow standard operating practices

• US Citizenship and ability to obtain and maintain a US Government Security Clearance

• Pay Range: $140,700 - $175,900

Our salary ranges are determined by…