Microelectronics Solder Assembler

At Spectrum Control, most departments operate on a 4-day, 10-hour work schedule in exchange for a 3-day weekend. We offer competitive wages and PTO, plus our benefits begin on day 1 of employment. Come join a workforce where we put you first!

We are seeking a highly skilled Senior Microelectronics Assembler to join our defense electronics manufacturing team. In this critical role, you will assemble high-reliability RF microelectronic modules using solder mount technology (SMT).

Wage Range: $30.00–$40.00/hr.

• Operate SMT microelectronics equipment: soldering irons, hot plates, vacuum ovens, reflow tools.
• Rework components as small as 0201 and various sizes of QFNs and packaged parts with tight pitch.
• Use flux and perform post‑solder cleaning on SMT boards for high quality.
• Solder connectors, strip leads, tin components and crimp harnesses.
• Interpret and work from detailed engineering and production drawings, process travelers, and assembly instructions.
• Maintain strict adherence to ESD controls, cleanroom protocols, and workmanship standards (e.g., J‑STD‑001 Class
  3).
• Learn advanced BGA solder reflow equipment.

• High school diploma or equivalent; technical certificate or associate degree preferred.
• Minimum 7 years of hands‑on experience in microelectronics assembly, specifically in defense or aerospace environments.
• Excellent hand‑eye coordination and manual dexterity for high‑precision work under a microscope and use of tweezers.
• Knowledge of military and aerospace standards (MIL‑STD‑883, J‑STD‑001 Class 3, IPC‑A‑610/STD‑001).
• Experience working in Class 1000 or Class 10,000 cleanroom environments.
• Certification in IPC J‑STD‑001 and/or MIL‑STD‑883 procedures.

• Self‑motivated, reliable, and able to work independently in a fast‑paced, secure environment.
• U.S. Citizenship to handle ITAR documents.
• Strong communication skills and ability to follow detailed instructions and process documentation.
• Work with engineers to aid in early development prototyping and contribute to process improvement initiatives.
• Leadership ability to train and work with other assemblers.
• Conduct die attach operations using conductive and non‑conductive epoxies or eutectic methods or learn attach methods.
• Collaborate with quality engineers and process engineers to troubleshoot issues and improve yields, as well as RF and hardware engineers on early development modules to meet customer needs.
• Perform precision assembly of high‑reliability microelectronic packages, including hybrid modules, IMA, MCMs, RF SMT boards and chip‑and‑wire assemblies.
• Inspect in‑process and final assemblies under high magnification to ensure compliance with military specifications (e.g., MIL‑PRF‑38534, MIL‑STD‑883).

Production Floor in a Manufacturing Facility.

Equal Opportunity Employer/Protected Veterans/Individuals with Disabilities.