FPA Assembly and Technician

Job Title: FPA Assembly and Technician

Job Code: 38642

Job Location: Mason, Ohio

Schedule: 1st Shift 9/80—Employees work 9 out of every 14 days, totaling 80 hours worked, and have every other Friday off.

As a Manufacturing Technician you will be responsible for processing and testing production of parts, components, subassemblies, and final assemblies. The ideal candidate will have experience as a skilled technician with exceptional ability for handling delicate semiconductor products on the process line. Those parts include high‑value wafers up to 200 mm diameter and discrete semiconductor die for assembly and test into FPAs.

• Set up and operate semiconductor processing / testing equipment.
• Perform manual and automated processes on high‑value, delicate wafer and discrete die / FPA products.
• Carefully handle and transport high‑value, delicate wafer and discrete die / FPA products.
• Inspect and measure semiconductor wafers and discrete die / FPAs with precision measuring equipment such as measuring microscopes, thickness measurement tools, flatness tools, and scanning electron microscopes.
• Process products with solvents, acids, bases and other flammable PACs.
• Accurately record data in computers using Excel and Access and manually in logbooks.
• Perform minor cleaning and maintenance on hardware tooling and processing equipment.
• Work extended hours or flex hours to meet short‑term business requirements as determined by management.
• Must be able to stand and or sit for long periods of time.
• Must be able to handle delicate parts in a steady fashion.
• Must be able to wear cleanroom garments to include facemask, safety glasses, gloves, full coverall, head cover, and boots.

• Requires a High School Diploma or equivalent and a minimum of 4 years of prior relevant experience or 2 years post‑Secondary/Associate’s Degree with 0 to 2 years of prior related experience.
• A minimum of 2 years of experience in a role requiring handling small and delicate parts.

• Candidate must demonstrate high attention to detail and a willingness to learn and develop their manufacturing skills through job training.
• Candidate must have the ability to follow detailed work instructions.
• Excellent teamwork and communication skills.
• Experience using hazardous chemicals in a manufacturing environment.
• Experience working in a cleanroom environment and handling semiconductor wafers is strongly desired.

Important Notice:
Many of our positions require the ability to obtain a security clearance. Security clearances may only be granted to U.S. citizens. In addition, applicants who accept a conditional offer of employment may be subject to government security investigations and must meet eligibility requirements for access to classified information.

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Harris Technologies is a proud Equal Opportunity Employer. L3

Harris is committed to treating all employees and applicants for employment with respect and dignity and maintaining a workplace that is free from unlawful discrimination. All applicants will be considered for employment without regard to race, color, religion, age, national origin, ancestry, ethnicity, gender (including pregnancy, childbirth, breastfeeding or other related medical conditions), gender identity, gender expression, sexual orientation, marital status, veteran status, disability, genetic information, citizenship status, characteristic or membership in any other group protected by federal, state or local laws.

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Harris maintains a drug‑free workplace and performs pre‑employment substance abuse testing and background checks, where permitted by law.

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Harris Technologies is an E‑Verify Employer.

By submitting your resume for this position, you understand and agree that L3

Harris Technologies may share your resume, as well as any other related personal information or documentation you provide, with its subsidiaries and affiliated companies for the purpose of considering you for other available positions.